SNOSCX9A March   2015  – November 2015 LPV542

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 1.8 V
    6. 6.6 Electrical Characteristics 3.3 V
    7. 6.7 Electrical Characteristics 5 V
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Rail-To-Rail Input
      2. 7.4.2 Supply Current Changes over Common Mode
      3. 7.4.3 Design Optimization With Rail-To-Rail Input
      4. 7.4.4 Design Optimization for Nanopower Operation
      5. 7.4.5 Common-Mode Rejection
      6. 7.4.6 Output Stage
      7. 7.4.7 Driving Capacitive Load
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application: 60 Hz Twin "T" Notch Filter
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

8-Pin VSSOP
DGK Package
Top View
LPV542 po_2333_so_msop_bos351.gif
8-Pad X1SON
DNX Package
Top View
LPV542 po_2333_dfn8_bos351.gif
1. Connect thermal die pad to V-.

Pin Functions

PIN I/O DESCRIPTION
NAME DGK DNX
OUT A 1 1 O Channel A Output
-IN A 2 2 I Channel A Inverting Input
+IN A 3 3 I Channel A Non-Inverting Input
V- 4 4 P Negative (lowest) power supply
+IN B 5 5 I Channel B Non-Inverting Input
-IN B 6 6 I Channel B Inverting Input
OUT B 7 7 O Channel B Output
V+ 8 8 P Positive (highest) power supply
Die Pad -- DAP P Die Attach Pad. Connect to V- (DNX package only)