SLVSJ10 December   2025 MC111

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings Comm
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Requirements
    7. 5.7 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Motor Control
        1. 6.3.1.1 Duty Input
        2. 6.3.1.2 Duty Curve
        3. 6.3.1.3 Motor Start, Speed Change, and Stop
        4. 6.3.1.4 Open-Loop (Duty Cycle) Control
        5. 6.3.1.5 Closed-Loop (Speed) Control
        6. 6.3.1.6 Commutation
          1. 6.3.1.6.1 Hall Sensor
            1. 6.3.1.6.1.1 Field Direction Definition
            2. 6.3.1.6.1.2 Internal Hall Latch Sensor Output
          2. 6.3.1.6.2 Hall Offset
          3. 6.3.1.6.3 Square Commutation
          4. 6.3.1.6.4 Soft Commutation
        7. 6.3.1.7 PWM Modulation Modes
      2. 6.3.2 Protections
        1. 6.3.2.1 Locked Rotor Protection
        2. 6.3.2.2 Current Limit
        3. 6.3.2.3 Overcurrent Protection (OCP)
        4. 6.3.2.4 VM Undervoltage Lockout (UVLO)
        5. 6.3.2.5 VM Over Voltage Protection (OVP)
        6. 6.3.2.6 Thermal Shutdown (TSD)
        7. 6.3.2.7 Integrated Supply (VM) Clamp
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
      2. 6.4.2 Sleep and Standby Mode
      3. 6.4.3 Fault Mode
      4. 6.4.4 Test Mode and One-Time Programmable Memory
    5. 6.5 Programming
      1. 6.5.1 I2C Communication
        1. 6.5.1.1 I2C Read
        2. 6.5.1.2 I2C Write
  8. 7 Register Map
    1. 7.1 USR_OTP Registers
    2. 7.2 USR_TM Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Components
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Bulk Capacitance
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History

Package Options

Mechanical Data (Package|Pins)
  • DYM|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.3.1.6.1.2 Internal Hall Latch Sensor Output

If the device is powered on with a magnetic field strength between BRP and BOP, then the internal Hall latch output signal is indeterminate. If the field strength is greater than BOP, then the internal Hall latch output signal is low. If the field strength is less than BRP, then the internal Hall latch output signal is high.

MC111 Internal Hall Output Signal Figure 6-13 Internal Hall Output Signal