SLAS703B April   2010  – August 2015 MSP430BT5190


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Characteristics
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Characteristics
    7. 5.7  Schmitt-Trigger Inputs - General-Purpose I/O
    8. 5.8  Inputs - Ports P1 and P2
    9. 5.9  Leakage Current - General-Purpose I/O
    10. 5.10 Outputs - General-Purpose I/O (Full Drive Strength)
    11. 5.11 Outputs - General-Purpose I/O (Reduced Drive Strength)
    12. 5.12 Output Frequency - General-Purpose I/O
    13. 5.13 Typical Characteristics - Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Typical Characteristics - Outputs, Full Drive Strength (PxDS.y = 1)
    15. 5.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 5.16 Crystal Oscillator, XT1, High-Frequency Mode
    17. 5.17 Crystal Oscillator, XT2
    18. 5.18 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    19. 5.19 Internal Reference, Low-Frequency Oscillator (REFO)
    20. 5.20 DCO Frequency
    21. 5.21 PMM, Brown-Out Reset (BOR)
    22. 5.22 PMM, Core Voltage
    23. 5.23 PMM, SVS High Side
    24. 5.24 PMM, SVM High Side
    25. 5.25 PMM, SVS Low Side
    26. 5.26 PMM, SVM Low Side
    27. 5.27 Wake-up Times From Low-Power Modes and Reset
    28. 5.28 Timer_A
    29. 5.29 Timer_B
    30. 5.30 USCI (UART Mode), Recommended Operating Conditions
    31. 5.31 USCI (UART Mode)
    32. 5.32 USCI (SPI Master Mode), Recommended Operating Conditions
    33. 5.33 USCI (SPI Master Mode)
    34. 5.34 USCI (SPI Slave Mode)
    35. 5.35 USCI (I2C Mode)
    36. 5.36 12-Bit ADC, Power Supply and Input Range Conditions
    37. 5.37 12-Bit ADC, Timing Parameters
    38. 5.38 12-Bit ADC, Linearity Parameters
    39. 5.39 12-Bit ADC, Temperature Sensor and Built-In VMID
    40. 5.40 REF, External Reference
    41. 5.41 REF, Built-In Reference
    42. 5.42 Flash Memory
    43. 5.43 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootstrap Loader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory
    8. 6.8  RAM
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O
      2. 6.9.2  Oscillator and System Clock
      3. 6.9.3  Power-Management Module (PMM)
      4. 6.9.4  Hardware Multiplier (MPY)
      5. 6.9.5  Real-Time Clock (RTC_A)
      6. 6.9.6  Watchdog Timer (WDT_A)
      7. 6.9.7  System Module (SYS)
      8. 6.9.8  DMA Controller
      9. 6.9.9  Universal Serial Communication Interface (USCI)
      10. 6.9.10 TA0
      11. 6.9.11 TA1
      12. 6.9.12 TB0
      13. 6.9.13 ADC12_A
      14. 6.9.14 CRC16
      15. 6.9.15 REF Voltage Reference
      16. 6.9.16 Embedded Emulation Module (EEM) (L Version)
      17. 6.9.17 Peripheral File Map
    10. 6.10 Input/Output Schematics
      1. 6.10.1  Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
      2. 6.10.2  Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
      3. 6.10.3  Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
      4. 6.10.4  Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
      5. 6.10.5  Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
      6. 6.10.6  Port P5, P5.2, Input/Output With Schmitt Trigger
      7. 6.10.7  Port P5, P5.3, Input/Output With Schmitt Trigger
      8. 6.10.8  Port P5, P5.4 to P5.7, Input/Output With Schmitt Trigger
      9. 6.10.9  Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
      10. 6.10.10 Port P7, P7.0, Input/Output With Schmitt Trigger
      11. 6.10.11 Port P7, P7.1, Input/Output With Schmitt Trigger
      12. 6.10.12 Port P7, P7.2 and P7.3, Input/Output With Schmitt Trigger
      13. 6.10.13 Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
      14. 6.10.14 Port P8, P8.0 to P8.7, Input/Output With Schmitt Trigger
      15. 6.10.15 Port P9, P9.0 to P9.7, Input/Output With Schmitt Trigger
      16. 6.10.16 Port P10, P10.0 to P10.7, Input/Output With Schmitt Trigger
      17. 6.10.17 Port P11, P11.0 to P11.2, Input/Output With Schmitt Trigger
      18. 6.10.18 Port J, J.0 JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      19. 6.10.19 Port J, J.1 to J.3 JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 6.11 Device Descriptors (TLV)
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Getting Started and Next Steps
      2. 7.1.2 Development Tools Support
        1. Hardware Features
        2. Recommended Hardware Options
          1. Experimenter Boards
          2. Debugging and Programming Tools
          3. Production Programmers
        3. Recommended Software Options
          1. Integrated Development Environments
          2. MSP430Ware
          3. TI-RTOS
          4. Command-Line Programmer
      3. 7.1.3 Device and Development Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Export Control Notice
    7. 7.7 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Device and Documentation Support

7.1 Device Support

7.1.1 Getting Started and Next Steps

For an introduction to the MSP430™ family of devices and the tools and libraries that are available to help with your development, visit the Getting Started page.

7.1.2 Development Tools Support

All MSP430™ microcontrollers are supported by a wide variety of software and hardware development tools. Tools are available from TI and various third parties. See them all at Hardware Features

See the Code Composer Studio for MSP430 User's Guide (SLAU157) for details on the available features.

MSP430 Architecture 4-Wire JTAG 2-Wire JTAG Break- points
Range Break- points Clock Control State Sequencer Trace Buffer LPMx.5 Debugging Support
MSP430Xv2 Yes Yes 8 Yes Yes Yes Yes No Recommended Hardware Options Experimenter Boards

Experimenter Boards and Evaluation kits are available for some MSP430 devices. These kits feature additional hardware components and connectivity for full system evaluation and prototyping. See for details. Debugging and Programming Tools

Hardware programming and debugging tools are available from TI and from its third party suppliers. See the full list of available tools at Production Programmers

The production programmers expedite loading firmware to devices by programming several devices simultaneously.

Part Number PC Port Features Provider
MSP-GANG Serial and USB Program up to eight devices at a time. Works with a PC or as a stand-alone device. Texas Instruments Recommended Software Options Integrated Development Environments

Software development tools are available from TI or from third parties. Open source solutions are also available.

This device is supported by Code Composer Studio™ IDE (CCS). MSP430Ware

MSP430Ware is a collection of code examples, data sheets, and other design resources for all MSP430 devices delivered in a convenient package. In addition to providing a complete collection of existing MSP430 design resources, MSP430Ware also includes a high-level API called MSP430 Driver Library. This library makes it easy to program MSP430 hardware. MSP430Ware is available as a component of CCS or as a stand-alone package. TI-RTOS

TI-RTOS is an advanced real-time operating system for the MSP430 microcontrollers. It features preemptive deterministic multitasking, hardware abstraction, memory management, and real-time analysis. TI-RTOS is available free of charge and is provided with full source code. Command-Line Programmer

MSP430 Flasher is an open-source, shell-based interface for programming MSP430 microcontrollers through a FET programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP430 Flasher can be used to download binary files (.txt or .hex) files directly to the MSP430 microcontroller without the need for an IDE.

7.1.3 Device and Development Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP430 MCU devices and support tools. Each MSP430 MCU commercial family member has one of three prefixes: MSP, PMS, or XMS (for example, MSP430F5438A). TI recommends two of three possible prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of product development from engineering prototypes (with XMS for devices and MSPX for tools) through fully qualified production devices and tools (with MSP for devices and MSP for tools).

Device development evolutionary flow:

XMS – Experimental device that is not necessarily representative of the electrical specifications for the final device

PMS – Final silicon die that conforms to the electrical specifications for the device but has not completed quality and reliability verification

MSP – Fully qualified production device

Support tool development evolutionary flow:

MSPX – Development-support product that has not yet completed TI's internal qualification testing.

MSP – Fully-qualified development-support product

XMS and PMS devices and MSPX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices and MSP development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, PZP) and temperature range (for example, T). Figure 7-1 provides a legend for reading the complete device name for any family member.

MSP430BT5190 Part_Number_Decoder_MSP430.gifFigure 7-1 Device Nomenclature

7.2 Documentation Support

The following documents describe the MSP430BT5190 device. Copies of these documents are available on the Internet at

    SLAU208MSP430x5xx and MSP430x6xx Family User's Guide. Detailed information on the modules and peripherals available in this device family.
    SLAZ071MSP430BT5190 Device Erratasheet. Describes the known exceptions to the functional specifications for all silicon revisions of this device.

7.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.

TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.4 Trademarks

MSP430, MicroStar Junior, Code Composer Studio, E2E are trademarks of Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

Mindtree is a trademark of Mindtree Ltd.

All other trademarks are the property of their respective owners.

7.5 Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.6 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.7 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.