SLOS075K November   1979  – December 2025 NE5532 , NE5532A , SA5532 , SA5532A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Unity-Gain Bandwidth
      2. 6.3.2 Common-Mode Rejection Ratio
      3. 6.3.3 Slew Rate
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Design Requirements
      2. 7.1.2 Detailed Design Procedure
        1. 7.1.2.1 Amplifier Selection
        2. 7.1.2.2 Passive Component Selection
      3. 7.1.3 Application Curves
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • PS|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 Power Supply Recommendations

The NE5532x and SA5532x devices are specified for operation over the range of ±5 to ±15 V; many specifications apply from 0°C to 70°C (NE5532x) and –40°C to +85°C (SA5532x). Section 5.7 presents parameters that exhibit significant variance with regard to operating voltage or temperature.

CAUTION:

Supply voltages outside of the ±22 V range are able to permanently damage the device (see Section 5.1).

Place 0.1μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-impedance power supplies. For more detailed information on bypass capacitor placement, see Section 7.3.1.