SPRS563G September 2008 – June 2014 OMAP-L137
TI offers an extensive line of development tools for the OMAP-L13x platform, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).
The following products support development of OMAP-L13x applications:
Software Development Tools:
Code Composer Studio™ Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any application.
Hardware Development Tools:
Extended Development System (XDS™) Emulator
For a complete listing of development-support tools for OMAP-L13x, visit the Texas Instruments web site on the Worldwide Web at www.ti.com uniform resource locator (URL). For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: X, P, or NULL (e.g., XOMAPL137). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (NULL/TMDS).
Device development evolutionary flow:
Support tool development evolutionary flow:
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
NULL devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZKB), the temperature range (for example, "Blank" is the commercial temperature range), and the device speed range in megahertz (for example, "Blank" is the default).
Figure 6-1 provides a legend for reading the complete device name for any OMAPL13x member.
The following documents describe the OMAP-L13x Low-power applications processor. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.
DSP/BIOS, TMS320C6000, C6000, E2E are trademarks of Texas Instruments.
ARM926EJ-S, ETM9, CoreSight are trademarks of ARM Limited.
All other trademarks are the property of their respective owners.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.