SBOS484D December   2009  – April 2016 OPA1641 , OPA1642 , OPA1644

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Output Current Limit
      3. 7.3.3 EMI Rejection Ratio (EMIRR)
        1. 7.3.3.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Voltage
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Noise Performance
      2. 8.1.2 Basic Noise Calculations
      3. 8.1.3 Total Harmonic Distortion Measurements
      4. 8.1.4 Source Impedance and Distortion
      5. 8.1.5 Capacitive Load and Stability
      6. 8.1.6 Power Dissipation and Thermal Protection
      7. 8.1.7 Electrical Overstress
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH® Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (December 2015) to D Revision

  • Added TI Design Go
  • Changed MSOP to VSSOP throughout document Go
  • Changed Supply voltage parameter in Recommended Operating Conditions table to split single and dual supply specifications into separate rows for clarityGo
  • Changed last column header in Thermal Information table from DGK (VSSOP) to PW (TSSOP)Go
  • Changed Noise subsection of Electrical Characteristics table: changed Input voltage noise parameter typical specification and changed first two en parameter typical specificationsGo
  • Changed Input Bias Current subsection of Electrical Characteristics tableGo
  • Changed VO parameter test conditions in Electrical Characteristics table Go
  • Added ISC parameter specifications to Electrical Characteristics table Go
  • Changed Temperature Range subsection of Electrical Characteristics table Go
  • Changed third paragraph of Power Dissipation and Thermal Protection section for clarity Go
  • Changed second paragraph of Electrical Overstress section for clarityGo
  • Added text reference for Equation 5 Go

Changes from B Revision (August 2010) to C Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added text to last bullet of Layout Guidelines sectionGo

Changes from A Revision (April 2010) to B Revision

  • Removed product-preview information for MSOP-8 package version of OPA1641Go

Changes from * Revision (December 2009) to A Revision

  • Removed product-preview information for OPA1644 device packages throughout documentGo