SBOS724A September 2015 – June 2022 OPA1688
PRODUCTION DATA
THERMAL METRIC(1) | OPA1688 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DRG (WSON) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 116.1 | 63.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 69.8 | 63.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 56.6 | 36.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 22.5 | 1.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 56.1 | 36.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 6.3 | °C/W |