SBOS936E November   2019  – August 2022 OPA182 , OPA2182 , OPA4182

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA182
    5. 7.5 Thermal Information: OPA2182
    6. 7.6 Thermal Information: OPA4182
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Phase-Reversal Protection
      2. 8.3.2 Input Bias Current Clock Feedthrough
      3. 8.3.3 EMI Rejection
      4. 8.3.4 Electrical Overstress
      5. 8.3.5 MUX-Friendly Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Strain Gauge Analog Linearization
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Rogowski Coil Integrator
      3. 9.2.3 System Examples
        1. 9.2.3.1 24-Bit, Delta-Sigma, Differential Load Cell or Strain Gauge Sensor Signal Conditioning
      4. 9.2.4 Programmable Power Supply
      5. 9.2.5 RTD Amplifier With Linearization
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
        2. 10.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 10.1.1.3 TI Reference Designs
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information: OPA182

THERMAL METRIC(1) OPA182 UNIT
D (SOIC) DBV (SOT-23)
8 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 112.9 138.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.8 63.8 °C/W
RθJB Junction-to-board thermal resistance 56.2 35.5 °C/W
ΨJT Junction-to-top characterization parameter 10.1 17.1 °C/W
ΨJB Junction-to-board characterization parameter 55.4 35.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.