SBOS826D December   2017  – October 2019 OPA207

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Ultra-Low 0.1-Hz to 10-Hz Noise
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Protection
      3. 7.3.3 ESD Protection
      4. 7.3.4 Input Stage Linearization
      5. 7.3.5 Rail-to-Rail Output
      6. 7.3.6 Low Input Bias Current
      7. 7.3.7 Slew Boost
      8. 7.3.8 EMI Rejection Ratio (EMIRR)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical OPA207 Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Precision Low-Side Current Sensing
      3. 8.2.3 Precision Buffer With Increased Output Current
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Webench Filter Designer Tool
        2. 11.1.1.2 TINA-TI (Free Software Download)
        3. 11.1.1.3 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) OPA207 UNIT
DGK (VSSOP) D (SOIC) DBV (SOT-23)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 176.7 121.5 166.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.9 64.3 116.9 °C/W
RθJB Junction-to-board thermal resistance 99.4 65.0 63.2 °C/W
ψJT Junction-to-top characterization parameter 8.8 18.2 45 °C/W
ψJB Junction-to-board characterization parameter 97.6 64.3 62.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package ThermalMetrics application report.