SBOS089A August   1998  – March 2026 OPA137 , OPA2137 , OPA4137

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics, VS = ±15V
    5. 5.5 Typical Characteristics
    6. 5.6 Old Die to New Die Transition
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Operating Voltage
      2. 6.1.2 Input Voltage
      3. 6.1.3 High-Side Current Sensing
      4. 6.1.4 Input Bias Current
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.