SBOS427F June   2017  – March 2021 OPA145 , OPA2145

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA145
    5. 6.5 Thermal Information: OPA2145
    6. 6.6 Electrical Characteristics: VS = 4.5 V to 36 V; ±2.25 V to ±18 V
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Capacitive Load and Stability
      2. 7.3.2 Output Current Limit
      3. 7.3.3 Noise Performance
      4. 7.3.4 Basic Noise Calculations
      5. 7.3.5 Phase-Reversal Protection
      6. 7.3.6 Electrical Overstress
      7. 7.3.7 EMI Rejection
      8. 7.3.8 EMIRR +IN Test Configuration
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 16-Bit, 100-kSPS, Fully Differential Transimpedance Imaging and Measurement
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ SImulation Software (Free Download)
        2. 11.1.1.2 WEBENCH Filter Designer Tool
        3. 11.1.1.3 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information: OPA2145

THERMAL METRIC(1) OPA2145 UNIT
D (SOIC) DGK (VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 118.7 163.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.3 53.4 °C/W
RθJB Junction-to-board thermal resistance 63.5 85.0 °C/W
ΨJT Junction-to-top characterization parameter 10.7 5.9 °C/W
ΨJB Junction-to-board characterization parameter 62.4 83.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, seethe Semiconductorand IC Package Thermal Metrics application report.