For best operational performance of the device, use good PCB layout practices, including:
Although the OPA2376YZD package has a protective backside coating that reduces the amount of light exposure on the die, unless fully shielded, ambient light can reach the active region of the device. Input bias current for the package is specified in the absence of light. Depending on the amount of light exposure in a given application, an increase in bias current, and possible increases in offset voltage, should be expected. Fluorescent lighting may introduce noise or hum because of the time-varying light output. Best layout practices include end-product packaging that provides shielding from possible light sources during operation.