SBOSAI0 December   2023 OPA310-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Operating Voltage
      2. 6.3.2 Rail-to-Rail Input
      3. 6.3.3 Rail-to-Rail Output
      4. 6.3.4 Capacitive Load and Stability
      5. 6.3.5 Overload Recovery
      6. 6.3.6 EMI Rejection
      7. 6.3.7 ESD and Electrical Overstress
      8. 6.3.8 Input ESD Protection
      9. 6.3.9 Shutdown Function
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 OPAx310-Q1 Low-Side, Current Sensing Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4.     Trademarks
    5. 8.4 Electrostatic Discharge Caution
    6. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DBV|6
  • DCK|5
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.6 EMI Rejection

The OPAx310-Q1 uses integrated electromagnetic interference (EMI) filtering to reduce the effects of EMI from sources such as wireless communications (radio frequency interference - RFI) and densely-populated boards with a mix of analog signal chain and digital components. EMI immunity can be improved with circuit design techniques; the OPAx310-Q1 benefits from these design improvements. Texas Instruments has developed the ability to accurately measure and quantify the immunity of an operational amplifier over a broad frequency spectrum extending from 10 MHz to 6 GHz. Figure 6-4 shows the results of this testing on the OPAx310-Q1. Table 6-1 shows the EMIRR IN+ values for the OPAx310-Q1 at particular frequencies commonly encountered in real-world applications. The EMI Rejection Ratio of Operational Amplifiers application report contains detailed information on the topic of EMIRR performance relating to op amps and is available for download from www.ti.com.

GUID-20220621-SS0I-MKBQ-5129-G1MDWW6PGC6X-low.gif Figure 6-4 EMIRR Testing
Table 6-1 OPAx310-Q1 EMIRR IN+ for Frequencies of Interest
FREQUENCY APPLICATION OR ALLOCATION EMIRR IN+
400 MHz Mobile radio, mobile satellite, space operation, weather, radar, ultra-high frequency (UHF) applications 48 dB
900 MHz Global system for mobile communications (GSM) applications, radio communication, navigation, GPS (to 1.6 GHz), GSM, aeronautical mobile, UHF applications 58 dB
1.8 GHz GSM applications, mobile personal communications, broadband, satellite, L-band (1 GHz to 2 GHz) 75 dB
2.4 GHz 802.11b, 802.11g, 802.11n, Bluetooth®, mobile personal communications, industrial, scientific and medical (ISM) radio band, amateur radio and satellite, S-band (2 GHz to 4 GHz) 90 dB
3.6 GHz Radiolocation, aero communication and navigation, satellite, mobile, S-band 95 dB
5 GHz 802.11a, 802.11n, aero communication and navigation, mobile communication, space and satellite operation, C-band (4 GHz to 8 GHz) 102 dB