SBOS703F April   2014  – October 2016 OPA2316 , OPA316 , OPA4316

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA316
    5. 6.5 Thermal Information: OPA2316
    6. 6.6 Thermal Information: OPA2316S
    7. 6.7 Thermal Information: OPA4316
    8. 6.8 Electrical Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Input and ESD Protection
      4. 7.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5 EMI Susceptibility and Input Filtering
      6. 7.3.6 Rail-to-Rail Output
      7. 7.3.7 Capacitive Load and Stability
      8. 7.3.8 Overload Recovery
      9. 7.3.9 DFN Package
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Configurations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Amplifier Selection
        2. 8.2.2.2 Passive Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
      1. 10.6 Electrostatic Discharge Caution
      2. 10.7 Glossary
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DCK Package
5-Pin SC70
Top View
OPA316 OPA2316 OPA2316S OPA4316 po_sc70_bos406.gif
DBV Package
5-Pin SOT-23
Top View
OPA316 OPA2316 OPA2316S OPA4316 po_sot23-5_bos406.gif
DRG Package
8-Pin DFN
Top View
OPA316 OPA2316 OPA2316S OPA4316 po_drb_dfn-8_bos563.gif

NOINDENT:

Pitch: 0.5 mm.

NOINDENT:

Connect thermal pad to V–. Pad size: 2.00 mm × 1.20 mm.
D, DGK Packages
8-Pin MSOP, SO
Top View
OPA316 OPA2316 OPA2316S OPA4316 po_so_msop_bos406.gif
DGS Package
10-Pin MSOP
Top View
OPA316 OPA2316 OPA2316S OPA4316 po_msop-10_bos703.gif
RUG Package
10-Pin QFN
Top View
OPA316 OPA2316 OPA2316S OPA4316 RUG_PKG_SBOS703.gif
D, PW Packages
14-Pin SOIC, TSSOP
Top View
OPA316 OPA2316 OPA2316S OPA4316 po_pw_tssop-14_bos563.gif

Pin Functions

PIN DESCRIPTION
NAME OPA316 OPA2316 OPA2316S OPA4316
DBV DCK D, DGK, DRG DGS RUG PW D
+IN 3 1 — — — — — Noninverting input
+IN A — — 3 3 10 3 3 Noninverting input
+IN B — — 5 7 4 5 5 Noninverting input
+IN C — — — — — 10 10 Noninverting input
+IN D — — — — — 12 12 Noninverting input
–IN 4 3 — — — — — Inverting input
–IN A — — 2 2 9 2 2 Inverting input
–IN B — — 6 8 5 6 6 Inverting input
–IN C — — — — — 9 9 Inverting input
–IN D — — — — — 13 13 Inverting input
OUT 1 4 — — — — — Output
OUT A — — 1 1 8 1 1 Output
OUT B — — 7 9 6 7 7 Output
OUT C — — — — — 8 8 Output
OUT D — — — — — 14 14 Output
SHDN A — — — 5 2 — — Shutdown (logic low), enable (logic high)
SHDN B — — — 6 3 — — Shutdown (logic low), enable (logic high)
V+ 5 5 8 10 7 4 4 Positive supply
V– 2 2 4 4 1 11 11 Negative supply or ground (for single-supply operation)