SLOS884B September   2014  – December 2018 OPA2320-Q1 , OPA320-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Zero Crossover Distortion: Low Offset Voltage
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics:
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and ESD Protection
      2. 7.3.2 Feedback Capacitor Improves Response
      3. 7.3.3 EMI Susceptibility And Input Filtering
      4. 7.3.4 Output Impedance
      5. 7.3.5 Capacitive Load and Stability
      6. 7.3.6 Overload Recovery Time
    4. 7.4 Device Functional Modes
      1. 7.4.1 Rail-to-Rail Input
      2. 7.4.2 Phase Reversal
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Transimpedance Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optimizing The Transimpedance Circuit
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High-Impedance Sensor Interface
      3. 8.2.3 Driving ADCs
      4. 8.2.4 Active Filter
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Optimizing The Transimpedance Circuit

To achieve the best performance, components should be selected according to the following guidelines:

  1. For lowest noise, select R(FB) to create the total required gain. Using a lower value for R(FB) and adding gain after the transimpedance amplifier generally produces poorer noise performance. The noise produced by R(FB) increases with the square-root of R(FB), whereas the signal increases linearly. Therefore, signal-to-noise ratio improves when all the required gain is placed in the transimpedance stage.
  2. Minimize photodiode capacitance and stray capacitance at the summing junction (inverting input). This capacitance causes the voltage noise of the op amp to be amplified (increasing amplification at high frequency). Using a low-noise voltage source to reverse-bias a photodiode can significantly reduce the capacitance. Smaller photodiodes have lower capacitance. Use optics to concentrate light on a small photodiode.
  3. Noise increases with increased bandwidth. Limit the circuit bandwidth to only that required. Use a capacitor across the R(FB) to limit bandwidth, even if not required for stability.
  4. Circuit board leakage can degrade the performance of an otherwise well-designed amplifier. Clean the circuit board carefully. A circuit board guard trace that encircles the summing junction and is driven at the same voltage can help control leakage.

For additional information, refer to the following documents: