SBOS099D September   2000  – December 2015 OPA2350 , OPA350 , OPA4350

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA350 and OPA2350
    5. 6.5 Thermal Information: OPA4350
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Capacitive Load and Stability
      5. 7.3.5 Driving A/D Converters
      6. 7.3.6 Output Impedance
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Second Order Low Pass Filter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single-Supply Video Line Driver
      3. 8.2.3 Adding a Feedback Capacitor to Improve Response
      4. 8.2.4 Two Op-Amp Instrumentation Amplifier With Improved High-Frequency Common-Mode Rejection
      5. 8.2.5 10-kHz High-Pass Filter
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage 7 V
Signal input terminals(2) Voltage (V−) − 0.3 (V+) + 0.3 V
Current 10 mA
Open short circuit current(3) Continuous
Operating temperature –55 150 °C
Lead temperature (soldering, 10 s) 300 °C
Junction temperature 150 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current-limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE UNIT
OPA350, OPA2350, OPA4350 (ALL PACKAGE TYPES)
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
OPA350, OPA2350, OPA4350 (SOIC PACKAGES ONLY)
V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Power supply voltage, (V+)-(V-) 2.7 (±1.35) 5 (±2.5) 5.5 (±2.75) V
Specified temperature –40 25 85 °C
Operating temperature –55 25 150 °C

6.4 Thermal Information: OPA350 and OPA2350

THERMAL METRIC(1) OPA350, OPA2350 UNIT
DGK (VSSOP) P (PDIP) D (SOIC)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 169.2 53.1 140.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.8 42.5 89.8 °C/W
RθJB Junction-to-board thermal resistance 89.8 30.3 80.6 °C/W
ψJT Junction-to-top characterization parameter 7.5 19.7 28.7 °C/W
ψJB Junction-to-board characterization parameter 88.2 30.2 80.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Thermal Information: OPA4350

THERMAL METRIC(1) OPA4350 UNIT
D (SOIC) DBQ (SSOP)
14 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 83.8 115.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.7 67 °C/W
RθJB Junction-to-board thermal resistance 59.5 58.3 °C/W
ψJT Junction-to-top characterization parameter 11.6 19.9 °C/W
ψJB Junction-to-board characterization parameter 37.7 57.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.6 Electrical Characteristics

VS = 2.7 V to 5.5 V; All specifications at TA = 25°C, RL = 1 kΩ connected to VS/2 and VOUT = VS/2, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VS = 5 V ±150 ±500 µV
TA = −40°C to 85°C ±1 mV
vs Temperature TA = –40°C to 85°C ±4 μV/°C
PSRR vs Power-supply rejection ratio VS = 2.7 V to 5.5 V, VCM = 0 V 40 150 µV/V
175
Channel separation (dual, quad) DC 0.15 µV/V
INPUT BIAS CURRENT
IB Input bias current ±0.5 ±10 pA
vs Temperature See Typical Characteristics
IOS Input offset current ±0.5 ±10 pA
NOISE
Input voltage noise, f = 100 Hz to 400 kHz 4 μVrms
en Input voltage noise density, f = 10 kHz 7 nV/√Hz
Input current noise density, f = 100 kHz 5 nV/√Hz
in Current noise density, f = 10 kHz 4 fA/√Hz
INPUT VOLTAGE RANGE
VCM Common-mode voltage range TA = −40°C to 85°C –0.1 (V+) + 0.1 V
CMRR Common-mode rejection ratio VS = 2.7 V, −0.1 V < VCM < 2.8 V 66 84 dB
VS = 5.5 V, −0.1 V < VCM < 5.6 V 74 90
TA = −40°C to 85°C,
VS = 5.5 V, −0.1 V < VCM < 5.6 V		 74
INPUT IMPEDANCE
Differential 1013 || 2.5 Ω || pF
Common-mode 1013 || 6.5 Ω || pF
OPEN-LOOP GAIN
AOL Open-loop voltage gain RL = 10 kΩ, 50 mV < VO < (V+) –50 mV 100 122 dB
TA = –40°C to 85°C RL = 10 kΩ, 50 mV < VO < (V+) –50 mV 100
RL = 1 kΩ, 200 mV < VO < (V+) –200 mV 100 120
RL = 1 kΩ, 200 mV < VO < (V+) –200 mV 100
FREQUENCY RESPONSE (CL = 100 pF)
GBW Gain-bandwidth product G = 1 38 MHz
SR Slew rate G = 1 22 V/µs
Settling time 0.1% G = ±1, 2-V Step 0.22 µs
0.01% 0.5
Overload recovery time VIN × G = VS 0.1 µs
THD+N Total harmonic distortion + noise RL = 600 Ω, VO = 2.5 VPP(2), G = 1, f = 1 kHz 0.0006%
Differential gain error G = 2, RL = 600 Ω, VO = 1.4 V(3) 0.17%
Differential phase error G = 2, RL = 600 Ω, VO = 1.4 V(3) 0.17 °
OUTPUT
VOUT Voltage output swing from rail(4) RL = 10 kΩ, AOL ≥ 100 dB 10 50 mV
TA = –40°C to 85°C RL = 10 kΩ, AOL ≥ 100 dB 50
RL = 1 kΩ, AOL ≥ 100 dB 25 200
IOUT Output current ±40(5) mA
ISC short circuit current ±80 mA
CLOAD Capacitive load drive See Typical Characteristics
POWER SUPPLY
VS Operating voltage range TA = −40°C to 85°C 2.7 5.5 V
Minimum operating voltage 2.5 V
IQ Quiescent current (per amplifier) IO = 0 5.2 7.5 mA
TA = –40°C to 85°C 8.5
TEMPERATURE RANGE
Specified range –40 85 °C
Operating range –55 150 °C
(1) VS = 5 V
(2) VOUT = 0.25 V to 2.75 V
(3) NTSC signal generator used. See Figure 31 for test circuit.
(4) Output voltage swings are measured between the output and power supply rails.
(5) See Figure 17.

6.7 Typical Characteristics

All specifications at TA = 25°C, VS = 5 V, and RL = 1 kΩ connected to VS/2, unless otherwise noted.
OPA350 OPA2350 OPA4350 sbos099_typchar_1.gif
Figure 1. Open-Loop Gain and Phase vs Frequency
OPA350 OPA2350 OPA4350 sbos099_typchar_3.gif
Figure 3. Input Voltage and Current Noise Spectral Density vs Frequency
OPA350 OPA2350 OPA4350 sbos099_typchar_5.gif
Figure 5. Total Harmonic Distortion + Noise vs Frequency
OPA350 OPA2350 OPA4350 sbos099_typchar_7.gif
Figure 7. Differential Gain and Phase vs Resistive Load
OPA350 OPA2350 OPA4350 sbos099_typchar_9.gif
Figure 9. Common-Mode and Power-Supply Rejection Ratio vs Temperature
OPA350 OPA2350 OPA4350 sbos099_typchar_11.gif
Figure 11. Quiescent Current and short circuit Current vs Temperature
OPA350 OPA2350 OPA4350 sbos099_typchar_13.gif
Figure 13. Input Bias Current vs Temperature
OPA350 OPA2350 OPA4350 sbos099_typchar_15.gif
Figure 15. Closed-Loop Output Impedance vs Frequency
OPA350 OPA2350 OPA4350 sbos099_typchar_17.gif
Figure 17. Output Voltage Swing vs Output Current
OPA350 OPA2350 OPA4350 sbos099_typchar_19.gif
Figure 19. Offset Voltage Production Distribution
OPA350 OPA2350 OPA4350 sbos099_typchar_21.gif
Figure 21. Small-Signal Overshoot vs Load Capacitance
OPA350 OPA2350 OPA4350 sbos099_typchar_23.gif
Figure 23. Small-Signal Step Response
CL = 100 pF
OPA350 OPA2350 OPA4350 sbos099_typchar_2.gif
Figure 2. Power Supply and Common-Mode Rejection Ratio vs Frequency
OPA350 OPA2350 OPA4350 sbos099_typchar_4.gif
Figure 4. Channel Separation vs Frequency
OPA350 OPA2350 OPA4350 sbos099_typchar_6.gif
Figure 6. Harmonic Distortion + Noise vs Frequency
OPA350 OPA2350 OPA4350 sbos099_typchar_8.gif
Figure 8. Open-Loop Gain vs Temperature
OPA350 OPA2350 OPA4350 sbos099_typchar_10.gif
Figure 10. Slew Rate vs Temperature
OPA350 OPA2350 OPA4350 sbos099_typchar_12.gif
Figure 12. Quiescent Current vs Supply Voltage
OPA350 OPA2350 OPA4350 sbos099_typchar_14.gif
Figure 14. Input Bias Current vs Input Common-Mode Voltage
OPA350 OPA2350 OPA4350 sbos099_typchar_16.gif
Figure 16. Maximum Output Voltage vs Frequency
OPA350 OPA2350 OPA4350 sbos099_typchar_18.gif
Figure 18. Open-Loop Gain vs Output Voltage Swing
OPA350 OPA2350 OPA4350 sbos099_typchar_20.gif
Figure 20. Offset Voltage Drift Production Distribution
OPA350 OPA2350 OPA4350 sbos099_typchar_22.gif
Figure 22. Settling Time vs Closed-Loop Gain
OPA350 OPA2350 OPA4350 sbos099_typchar_24.gif
Figure 24. Large-Signal Step Response
CL = 100 pF