SBOS549C April   2011  – March 2021 OPA2376-Q1 , OPA376-Q1 , OPA4376-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA376-Q1
    5. 6.5 Thermal Information: OPA2376-Q1
    6. 6.6 Thermal Information: OPA4376-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Offset Voltage and Input Offset Voltage Drift
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 Common-Mode Voltage Range
      5. 7.3.5 Input and ESD Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Amplifier Configurations
      2. 8.1.2 Active Filtering
      3. 8.1.3 Driving an Analog-to-Digital Converter
      4. 8.1.4 Phantom-Powered Microphone
      5. 8.1.5 Speech Bandpass-Filtered Data Acquisition System
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH® Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (May 2016) to Revision C (March 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Deleted HBM and CDM classification levels from Features and moved to ESD Ratings Go
  • Added functional safety links to Features Go
  • Changed Applications bulletsGo
  • Changed ESD Ratings to show HBM and CDM classification levelsGo
  • Added link to new vcm vs temp plot in common-mode input cap rowGo
  • Added Figure 6-8, Common-Mode Voltage vs Temperature Go
  • Added Figure 6-9, Offset Voltage vs Common-Mode Voltage Go

Changes from Revision A (January 2016) to Revision B (May 2016)

  • Updated Applications examplesGo
  • Updated the Pin Functions Table for OPA4376-Q1Go
  • Updated HBM ESD Rating Go
  • Changed units on Channel Separation Go
  • Deleted the temperature range parameters from the Electrical Characteristics tableGo
  • Removed section regarding WCSP photosensitivity Go

Changes from Revision * (April 2011) to Revision A (January 2016)

  • Added Pin Functions table, ESD Ratings table, Recommended Operating Conditions table, Thermal Information tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Released the OPA2376-Q1 device as Production Data Go
  • Added the Input Offset Voltage and Input Offset Voltage Drift section to the Feature Description Go