SBOSAE8C October   2023  – April 2025 OPA2323 , OPA323 , OPA4323

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Operating Voltage
      2. 7.3.2  Rail-to-Rail Input
      3. 7.3.3  Rail-to-Rail Output
      4. 7.3.4  Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5  Capacitive Load and Stability
      6. 7.3.6  Overload Recovery
      7. 7.3.7  EMI Rejection
      8. 7.3.8  ESD and Electrical Overstress
      9. 7.3.9  Input ESD Protection
      10. 7.3.10 Shutdown Function
      11. 7.3.11 Packages with an Exposed Thermal Pad
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 OPAx323 in Low-Side, Current Sensing Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4.     Trademarks
    5. 9.4 Electrostatic Discharge Caution
    6. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYY|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VS = (V+) – (V–) Supply voltage, VS = (V+) – (V–) 0 7.0 V
Signal input pins Common-mode voltage (2) (3) – 0.5 6.0 V
Differential voltage (2) (3) ±6.0 V
Current (3) –10 10 mA
Output short-circuit (4) Continuous
Operating ambient temperature, TA –55 150 °C
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.
(2) Input pins can swing beyond (V+) but not ±6V. No diode structure from input pins to (V+). 
(3) Input pins are diode-clamped to (V–). Input signals that 0.3V below (V–) must be current-limited to 10mA or less. 
(4) Short-circuit to ground, one amplifier per package.