SBOS233H March   2002  – October 2025 OPA2354 , OPA354 , OPA4354

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information OPA354
    5. 6.5 Thermal Information OPA2354
    6. 6.6 Thermal Information OPA4354
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Output Drive
      5. 7.3.5 Video
      6. 7.3.6 Driving Analog-to-Digital Converters
      7. 7.3.7 Capacitive Load and Stability
      8. 7.3.8 Wideband Transimpedance Amplifier
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Optimizing the Transimpedance Circuit
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
        2. 8.4.1.2 Thermally Enhanced PowerPAD Integrated Circuit Package
        3. 8.4.1.3 PowerPAD™ Integrated Circuit Package Assembly Process
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision G (April 2018) to Revision H (August 2026)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated Thermal Information for OPA354 DBV and DDA packagesGo
  • Updated Input current noise, rise & fall time, open-loop output resistance, quiescent current in Electrical Characteristics for OPA354Go
  • Updated plots in Typical CharacteristicsGo

Changes from Revision F (June 2016) to Revision G (April 2018)

  • Updated plots in Typical CharacteristicsGo

Changes from Revision E (March 2002) to Revision F (June 2016)

  • Added ESD Ratings, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted Package/Ordering Information table, see POA at the end of data sheetGo
  • Changed OPAx354 Related Products table to Device Comparison Table Go