SBOS279F September   2003  – September 2016 OPA2373 , OPA2374 , OPA373 , OPA374 , OPA4374

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA373
    5. 7.5  Thermal Information: OPA374
    6. 7.6  Thermal Information: OPA2373
    7. 7.7  Thermal Information: OPA2374
    8. 7.8  Thermal Information: OPA4374
    9. 7.9  Electrical Characteristics: VS = 2.7 V to 5.5 V
    10. 7.10 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Common-Mode Voltage Range
      3. 8.3.3 Rail-to-Rail Input
      4. 8.3.4 Rail-to-Rail Output
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 Enable or Shutdown
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 Driving ADCs
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 VSON Package
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ (Free Software Download)
        2. 12.1.1.2 DIP Adapter EVM
        3. 12.1.1.3 Universal Op Amp EVM
        4. 12.1.1.4 TI Precision Designs
        5. 12.1.1.5 WEBENCH Filter Designer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison Table

DEVICE NO. OF
CHANNELS
SHUTDOWN PACKAGE-PIN
SOIC SOT-23 VSON VSSOP TSSOP
OPA373 1 Yes 8 6
OPA2373 2 Yes 10 10
OPA374 1 No 8 5
OPA2374 2 No 8 8
OPA4374 4 No 14 14