SBOS070D October   1997  – December 2019 OPA548

PRODUCTION DATA.  

  1. Features
  2. Applications
    1.     Simplified Schematic
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
      2. 7.3.2 Enable/Status (E/S) Pin
      3. 7.3.3 Thermal Shutdown Status
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Disable
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Basic Circuit Connections
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Power Supply Requirements
          2. 8.2.1.2.2 Gain Setting and Input Configuration
          3. 8.2.1.2.3 Current Limit
          4. 8.2.1.2.4 Safe-Operating-Area
          5. 8.2.1.2.5 Heat Sinking
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Monitoring Single- and Dual-Supplies
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Disable and Thermal Shutdown Status
      3. 8.2.3 Programmable Power Supply
    3. 8.3 System Examples
  9. Power Supply Recommendations
    1. 9.1 Output Stage Compensation
    2. 9.2 Output Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Safe Operating Area
      2. 10.1.2 Amplifier Mounting
      3. 10.1.3 Power Dissipation
      4. 10.1.4 Thermal Considerations
      5. 10.1.5 Heat Sinking
        1. 10.1.5.1 Heat Sink Selection Example
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The OPA548 device is a low-cost, high-voltage, and high-current operational amplifier that is designed to drive a wide variety of loads. A laser-trimmed, monolithic, integrated circuit provides excellent low-level signal accuracy and high-output voltage and current.

The OPA548 operates from either single or dual supplies for design flexibility. In single-supply operation, the input common-mode range extends below ground.

The OPA548 is internally protected against overtemperature conditions and current overloads. In addition, the OPA548 is designed to provide an accurate, user-selected current limit. Unlike other designs that use a power resistor in series with the output current path, the OPA548 senses the load indirectly. The current limit is adjustable from 0 A to 5 A with an external resistor and potentiometer, or controllable digitally with a voltage-out or current-out DAC.

The Enable/Status (E/S) pin provides two functions. An input on the pin not only disables the output stage to effectively disconnect the load, but also reduces the quiescent current to conserve power. The E/S pin output can be monitored to determine if the OPA548 is in thermal shutdown.

The OPA548 device is available in an industry-standard 7-lead staggered and straight lead TO-220 package, and a 7-lead DDPAK surface-mount plastic power package. The copper tab allows easy mounting to a heat sink or circuit board for excellent thermal performance. The device is specified for operation over the extended industrial temperature range, –40°C to 85°C. A SPICE macromodel is available for design analysis.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
OPA548 TO-220 (7) 10.17 mm × 8.38 mm
TO-263 (7) 10.10 mm × 8.89 mm
  1. For all available packages, see the package option addendum at the end of the data sheet.