SBOS847A July   2022  – December 2022 OPA817

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Typical Characteristics: VS = ±5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and ESD Protection
      2. 8.3.2 Feedback Pin
      3. 8.3.3 FET-Input Architecture with Wide Gain-Bandwidth Product
      4. 8.3.4 Device Functional Modes
        1. 8.3.4.1 Power-Down (PD) Pin
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Wideband, High-Input Impedance DAQ Front-End
    2. 9.2 Typical Applications
      1. 9.2.1 High Input Impedance, 200 MHz, Digitizer Front-End Amplifier Design
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

NC - no internal connection
Figure 6-1 DTK Package,8-Pin WSON With Thermal Pad(Top View)
Table 6-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
FB 2 O Feedback resistor connection (optional)
IN– 3 I Inverting input
IN+ 4 I Noninverting input
NC 6 — No connect (no internal connection to die)
OUT 7 O Output of amplifier
PD 1 I Power down (low = amplifier enabled, high = amplifier disabled); internal 2-MΩ pull-up allows floating this pin
VS– 5 P Negative power supply
VS+ 8 P Positive power supply
Thermal pad — Electrically isolated from the die substrate. The thermal pad can be connected to any potential between the device power-supplies, but it is recommended to connect it to a heat-spreading plane, typically ground.
(1) I = input, O = output, P = power