SBOSA10F June   2021  – March 2024 OPA2992 , OPA4992 , OPA992

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Protection Circuitry
      2. 6.3.2  EMI Rejection
      3. 6.3.3  Thermal Protection
      4. 6.3.4  Capacitive Load and Stability
      5. 6.3.5  Common-Mode Voltage Range
      6. 6.3.6  Phase Reversal Protection
      7. 6.3.7  Electrical Overstress
      8. 6.3.8  Overload Recovery
      9. 6.3.9  Typical Specifications and Distributions
      10. 6.3.10 Packages With an Exposed Thermal Pad
      11. 6.3.11 Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 High Voltage Buffered Multiplexer
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision E (January 2024) to Revision F (March 2024)

  • Changed the maximum PSRR (5V to 40V) for OPA2992SIRUGR from 1.3µV/V to 3.7µV/VGo

Changes from Revision D (August 2022) to Revision E (January 2024)

  • Removed Preview comments for X2QFN (10) package.Go

Changes from Revision C (March 2022) to Revision D (August 2022)

  • Added X2QFN (10) to Description with preview statusGo
  • Added X2QFN (RUG) package to Pin Configuration and Functions with preview statusGo

Changes from Revision B (December 2021) to Revision C (March 2022)

  • Adjusted the typical CMRR value for VS = 2.7 – 40 V, (V+) – 1  < VCM < V+ (NMOS pair) from "90 dB" to "79 dB" in the Electrical Characteristics sectionGo
  • Adjusted the AOL test condition from "VS = 40 V, VCM = VS / 2, (V–) + 0.1 V < VO < (V+) –  0.1 V" to "VS = 40 V, VCM = VS / 2, (V–) + 0.12 V < VO < (V+) –  0.12 V" in the Electrical Characteristics sectionGo
  • Adjusted the typical tON Amplifier Enable Time value from "15 µs" to "5 µs" in the Electrical Characteristics sectionGo
  • Adjusted the typical SHDN pin input bias current value for VS = 2.7 V to 40 V, (V–) ≤ SHDN ≤ (V–) + 0.7 V from "150 nA" to "400 nA" in the Electrical Characteristics sectionGo
  • Removed "Open-Loop Gain and Phase vs Frequency" figure in Typical Characteristics sectionGo

Changes from Revision A (October 2021) to Revision B (December 2021)

  • Added PSRR specification for OPA4992 release in Electrical Characteristics sectionGo
  • Added clarification to VS = 2.7 V to 40 V PSRR specification noting that specification is for all channel variantsGo
  • Changed y-axis from linear scale to logarithmic scale in "Input Voltage Noise Spectral Density vs Frequency" figure in Typical Characteristics sectionGo
  • Corrected typo in Shutdown of Feature Description section from "...specified 10kΩ load to midsupply (VS / 2)" to "...specified 10kΩ load to V-".Go

Changes from Revision * (June 2021) to Revision A (October 2021)

  • Changed the device status from Advance Information to Production Data Go