SCPS178C July   2007  – April 2022 PCA9306-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: Translating Down, VIH = 3.3 V
    7. 7.7  Switching Characteristics: Translating Down, VIH = 2.5 V
    8. 7.8  Switching Characteristics: Translating Up, VIH = 2.3 V
    9. 7.9  Switching Characteristics: Translating Up, VIH = 1.5 V
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 Definition of threshold voltage
      2. 9.1.2 Correct Device Set Up
      3. 9.1.3 Disconnecting a Target from the Main I2C Bus Using the EN Pin
      4. 9.1.4 Supporting Remote Board Insertion to Backplane with PCA9306-Q1
      5. 9.1.5 Switch Configuration
      6. 9.1.6 Controller on Side 1 or Side 2 of Device
      7. 9.1.7 LDO and PCA9306-Q1 Concerns
      8. 9.1.8 Current Limiting Resistance on VREF2
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable (EN) Pin
      2. 9.3.2 Voltage Translation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 General Applications of I2C
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Bidirectional Translation
        2. 10.2.2.2 Sizing Pullup Resistor
        3. 10.2.2.3 PCA9306-Q1 Bandwidth
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)DCU (VSSOP)UNIT
8 PINS
RθJA(2)Junction-to-ambient thermal resistance275.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance127.1°C/W
RθJBJunction-to-board thermal resistance186.9°C/W
ψJTJunction-to-top characterization parameter65.7°C/W
ψJBJunction-to-board characterization parameter185.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.