SCPS113M October   2004  – April 2019 PCA9306

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics AC Performance (Translating Down) (EN = 3.3 V)
    7. 6.7  Switching Characteristics AC Performance (Translating Down) (EN = 2.5 V)
    8. 6.8  Switching Characteristics AC Performance (Translating Up) (EN = 3.3 V)
    9. 6.9  Switching Characteristics AC Performance (Translating Up) (EN = 2.5 V)
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Definition of threshold voltage
      2. 8.1.2 Correct Device Set Up
      3. 8.1.3 Disconnecting a Slave from the Main I2C Bus Using the EN Pin
      4. 8.1.4 Supporting Remote Board Insertion to Backplane with PCA9306
      5. 8.1.5 Switch Configuration
      6. 8.1.6 Master on Side 1 or Side 2 of Device
      7. 8.1.7 LDO and PCA9306 Concerns
      8. 8.1.8 Current Limiting Resistance on VREF2
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable (EN) Pin
      2. 8.3.2 Voltage Translation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 General Applications of I2C
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bidirectional Voltage Translation
        2. 9.2.2.2 Sizing Pullup Resistors
        3. 9.2.2.3 PCA9306 Bandwidth
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 2-Bit bidirectional translator for SDA and SCL lines in mixed-mode I2C Applications
  • I2C and SMBus Compatible
  • Less than 1.5-ns Maximum Propagation Delay to Accommodate Standard-mode and Fast-mode I2C Devices and Multiple Masters
  • Allows Voltage-level Translation Between
    • 1.2-V VREF1 and 1.8-V, 2.5-V, 3.3-V,
      or 5-V VREF2
    • 1.8-V VREF1 and 2.5-V, 3.3-V, or 5-V VREF2
    • 2.5-V VREF1 and 3.3-V or 5-V VREF2
    • 3.3-V VREF1 and 5-V VREF2
  • Provides Bidirectional Voltage Translation with no Direction Pin
  • Low 3.5-Ω ON-state Resistance Between Input and Output Ports Provides Less Signal Distortion
  • Open-drain I2C I/O ports (SCL1, SDA1, SCL2, and SDA2)
  • 5-V Tolerant I2C I/O Ports to Support Mixed-mode Signal Operation
  • High-impedance SCL1, SDA1, SCL2, and SDA2 pins for EN = Low
  • Lockup-free Operation for Isolation when EN = Low
  • Flow-through Pinout for Ease of Printed-circuit-board Trace Routing
  • Latch-up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)