SCPS113O october   2004  – september 2023 PCA9306

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics AC Performance (Translating Down) (EN = 3.3 V)
    7. 6.7  Switching Characteristics AC Performance (Translating Down) (EN = 2.5 V)
    8. 6.8  Switching Characteristics AC Performance (Translating Up) (EN = 3.3 V)
    9. 6.9  Switching Characteristics AC Performance (Translating Up) (EN = 2.5 V)
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Definition of threshold voltage
      2. 8.1.2 Correct Device Set Up
      3. 8.1.3 Disconnecting an I2C target from the Main I2C Bus Using the EN Pin
      4. 8.1.4 Supporting Remote Board Insertion to Backplane with PCA9306
      5. 8.1.5 Switch Configuration
      6. 8.1.6 Controller on Side 1 or Side 2 of Device
      7. 8.1.7 LDO and PCA9306 Concerns
      8. 8.1.8 Current Limiting Resistance on VREF2
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable (EN) Pin
      2. 8.3.2 Voltage Translation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 General Applications of I2C
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bidirectional Voltage Translation
        2. 9.2.2.2 Sizing Pullup Resistors
        3. 9.2.2.3 PCA9306 Bandwidth
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision N (October 2021) to Revision O (September 2023)

  • Changed Device Information table to the Package Information table Go
  • Changed the Thermal Information table values for the DQE packageGo

Changes from Revision M (April 2019) to Revision N (October 2021)

  • Globally changed instances of legacy terminology to controller and target where I2C is mentionedGo
  • Changed the Thermal Information table values for the DCT and DCU packagesGo
  • Changed the MIN and MAX values of VIK in the Electrical Characteristics tableGo
  • Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Down) (EN = 3.3 V) tableGo
  • Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Down) (EN = 2.5 V) tableGo
  • Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Up) (EN = 3.3 V) tableGo
  • Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Up) (EN = 2.5 V) tableGo

Changes from Revision L (April 2016) to Revision M (April 2019)

  • Changed the DQE package family From: VSSON to X2SONGo
  • Added new section to Overview Go
  • Changed the labels in Figure 9-4. The red curve is > 2 V, the black curve is ≤ 2 V. Go

Changes from Revision K (October 2014) to Revision L (April 2016)

  • Changed "ON-State Connection " to "ON-state Resistance"Go
  • Deleted machine model ESD rating Go
  • Added "bus" following "100-kHz" in the last sentence of the Description sectionGo
  • Changed body-size dimensions in the Device Information table Go
  • Replaced pinout diagramsGo
  • Added I/O column to the Pin Functions table Go
  • Deleted RVH package from Pin Configuration and Functions section Go
  • Moved Tstg from Handling Ratings to Absolute Maximum Ratings Go
  • Added a note following the Electrical Characteristics tableGo
  • Added Figure 7-1 to the Parameter Measurement Information sectionGo
  • Changed Figure 7-2 Go
  • Changed "repeater" to "level shifter" in second paragraph of the Overview section Go
  • Deleted the last row of the Design Requirements table. Go
  • Corrected equation from fknee= 0.5 / RT (10%–80%) to fknee= 0.5 / RT (10%–90%)Go

Changes from Revision J (October 2010) to Revision K (December 2012)

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go