SCPS069G July   2001  – August 2021 PCF8574A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Simplified Block Diagram of Device
      2. 8.2.2 Simplified Schematic Diagram of Each P-Port Input/Output
    3. 8.3 Feature Description
      1. 8.3.1 I2C Interface
      2. 8.3.2 Interface Definition
      3. 8.3.3 Address Reference
    4. 8.4 Device Functional Modes
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Glossary
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DW|16
  • N|16
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision F (January 2015) to Revision G (August 2021)

  • Globally changed instances of legacy terminology to commander and responder where mentionedGo
  • Changed the Thermal Information table.Go
  • Changed Figure 7-2 Responder address from: S0100 To: S0111Go
  • Changed Figure 8-1 Go
  • Changed Note B from: configured as 0100000to: configured as 0111000Go

Changes from Revision E (January 2015) to Revision F (January 2015)

  • Added Junction temperature to the Absolute Maximum Ratings Go
  • Changed Supply Current (A) To: Supply Current (µA) and fSCL = 400 kHz to fSCL = 100 kHz in Figure 6-1 Go
  • Changed Supply Current (A) To: Supply Current (µA) in Figure 6-2 Go
  • Changed Supply Current (A) To: Supply Current (µA) and fSCL = 400 kHz to fSCL = 100 kHz in Figure 6-3 Go

Changes from Revision D (October 2005) to Revision E (January 2015)

  • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Deleted Ordering Information table.Go