SLES211C February 2008 – July 2015 PCM1681 , PCM1681-Q1
PRODUCTION DATA.
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage | VCC1, VCC2 | –0.3 | 6.5 | V |
| VDD | –0.3 | 4 | V | |
| Supply voltage differences | VCC1, VCC2 | –0.1 | 0.1 | V |
| Ground voltage differences | AGND1, AGND2, DGND | –0.1 | V | |
| Input voltage to digital pins | ZR1/ZR1/FMT0, ZR2, MSEL | –0.3 | VDD + 0.3, < 4 | V |
| MS/ADR/FMT1, MC/SCL/DEMP, MD/SDA/MUTE, SCK, BCK, LRCK, DATA1, 2, 3, 4 |
–0.3 | 6.5 | V | |
| Input voltage to analog pins | –0.3 | VCC + 0.3, < 6.5 | V | |
| Input current any pins except supplies | –10 | 10 | mA | |
| Ambient temperature under bias | –40 | 125 | °C | |
| Junction temperature , TJ | 150 | °C | ||
| Package temperature (IR reflow, peak) | 260 | °C | ||
| Storage temperature, Tstg | –55 | 150 | °C | |
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±4000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 | |||
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2000 | V |
| Charged-device model (CDM), per AEC Q100-011 | ±1000 | |||
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| Analog supply voltage, VCC1, VCC2 | 4.5 | 5 | 5.5 | V | |
| Digital supply voltage, VDD | 3 | 3.3 | 3.6 | V | |
| Digital input logic family | TTL | ||||
| Digital input clock frequency | System clock | 1.024 | 36.864 | MHz | |
| Sampling clock | 8 | 192 | kHz | ||
| Analog output load resistance | 5 | kΩ | |||
| Analog output load capacitance | 50 | pF | |||
| Digital output load capacitance | 20 | pF | |||
| Operating free-air temperature, TA | PCM1681 | –40 | 85 | °C | |
| PCM1681-Q1 | –40 | 105 | °C | ||
| THERMAL METRIC(1) | PCM1681, PCM1681-Q1 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 28 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 14.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 12.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 12.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.1 | °C/W |
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| RESOLUTION | 24 | bits | ||||
| DATA FORMAT | ||||||
| Audio data interface format | Right-justified, I2S, left-justified, TDM | |||||
| Audio data bit length | 16-, 18-, 20-, or 24-bits, selectable | |||||
| Audio data format | MSB-first, 2s complement | |||||
| fS | Sampling frequency | 5 | 200 | kHz | ||
| System clock frequency | 128, 192, 256, 384, 512, 768, 1152 fS |
|||||
| DIGITAL INPUT/OUTPUT | ||||||
| Logic family | TTL compatible | |||||
| VIH(1) | Input logic level | 2.0 | VDD | VDC | ||
| VIL(1) | 0.8 | |||||
| VIH(2) | 2.0 | 5.5 | ||||
| VIL(2) | 0.8 | |||||
| IIH(1)(2) | Input logic current | VIN = VDD | 10 | μA | ||
| IIL(1)(2) | VIN = 0 V | –10 | ||||
| VOH(3) | Output logic level | IOH = –1 mA | 2.4 | VDC | ||
| VOL(3)(4) | IOL = 1 mA | 0.4 | ||||
| DYNAMIC PERFORMANCE(5) | ||||||
| THD+N | Total harmonic distortion + noise | VOUT = 0 dB, fS = 48 kHz | 0.002% | 0.008% | ||
| VOUT = 0 dB, fS = 96 kHz, system clock = 256 fS | 0.002% | |||||
| VOUT = 0 dB, fS = 192 kHz, system clock = 128 fS |
0.002% | |||||
| Dynamic range | EIAJ, A-weighted, fS = 48 kHz | 100 | 105 | dB | ||
| A-weighted, fS = 96 kHz, system clock = 256 fS | 105 | |||||
| A-weighted, fS = 192 kHz, system clock = 128 fS | 105 | |||||
| SNR | Signal-to-noise ratio | EIAJ, A-weighted, fS = 48 kHz | 100 | 105 | dB | |
| A-weighted, fS = 96 kHz, system clock = 256 fS | 105 | |||||
| A-weighted, fS = 192 kHz, system clock = 128 fS | 105 | |||||
| Channel separation | fS = 48 kHz | 94 | 102 | dB | ||
| fS = 96 kHz, system clock = 256 fS | 102 | |||||
| fS = 192 kHz, system clock = 128 fS | 102 | |||||
| DC ACCURACY | ||||||
| Gain error | ±2.0 | ±6 | % of FSR | |||
| Gain mismatch, channel-to-channel | ±2.0 | ±6 | % of FSR | |||
| Bipolar zero error | VOUT = 0.486 VCC at BPZ input | ±30 | ±80 | mV | ||
| ANALOG OUTPUT | ||||||
| Output voltage | Full-scale (–0 dB) | 0.75 VCC | VPP | |||
| Bipolar zero voltage | 0.486 VCC | VDC | ||||
| Load impedance | AC-coupled load | 5 | kΩ | |||
| DIGITAL FILTER PERFORMANCE | ||||||
| Filter Characteristics (Sharp Roll-Off) | ||||||
| Passband | ±0.015 dB | 0.454 fS | ||||
| Stop band | 0.546 fS | |||||
| Passband ripple | ±0.015 | dB | ||||
| Stop band attenuation | Stop band = 0.546 fS | –57 | dB | |||
| Filter Characteristics (Slow Roll-Off) | ||||||
| Passband | ±0.004 dB | 0.261 fS | ||||
| Stop band | 0.727 fS | |||||
| Passband ripple | ±0.004 | dB | ||||
| Stop band attenuation | Stop band = 0.727 fS | –56 | dB | |||
| Filter Characteristics | ||||||
| Delay time | 24/fS | |||||
| De-emphasis error | ±0.1 | dB | ||||
| ANALOG FILTER PERFORMANCE | ||||||
| Frequency response | at 20 kHz | –0.02 | dB | |||
| at 44 kHz | –0.07 | |||||
| POWER-SUPPLY REQUIREMENTS | ||||||
| VDD | Voltage range | 3 | 3.3 | 3.6 | VDC | |
| VCC | 4.5 | 5.0 | 5.5 | |||
| IDD | Supply current | fS = 48 kHz | 13 | 20 | mA | |
| fS = 96 kHz, system clock = 256 fS | 18 | |||||
| fS = 192 kHz, system clock = 128 fS | 23 | |||||
| ICC | Supply current | fS = 48 kHz | 62 | 80 | mA | |
| fS = 96 kHz, system clock = 256 fS | 62 | |||||
| fS = 192 kHz, system clock = 128 fS | 62 | |||||
| Power dissipation | fS = 48 kHz | 353 | 466 | mW | ||
| fS = 96 kHz, system clock = 256 fS | 369 | |||||
| fS = 192 kHz, system clock = 128 fS | 386 | |||||
| TEMPERATURE RANGE | ||||||
| Operating temperature | PCM1681 | –40 | 85 | °C | ||
| PCM1681-Q1 | –40 | 105 | °C | |||
| θJA | Thermal resistance | 28-pin TSSOP PowerPAD™ | 28 | °C/W | ||
| PARAMETER | MIN | MAX | UNIT | |
|---|---|---|---|---|
| f(SCL) | SCL clock frequency | 100 | kHz | |
| t(BUF) | Bus free time between a STOP and START condition | 4.7 | μs | |
| t(LOW) | Low period of the SCL clock | 4.7 | μs | |
| t(HI) | High period of the SCL clock | 4 | μs | |
| t(RS-SU) | Setup time for (repeated) START condition | 4.7 | μs | |
| t(S-HD)
t(RS-HD) |
Hold time for (repeated) START condition | 4 | μs | |
| t(D-SU) | Data setup time | 250 | ns | |
| t(D-HD) | Data hold time | 0 | 900 | ns |
| t(SCL-R) | Rise time of SCL signal | 20 + 0.1 CB | 1000 | ns |
| t(SCL-R1) | Rise time of SCL signal after a repeated START condition and after an acknowledge bit | 20 + 0.1 CB | 1000 | ns |
| t(SCL-F) | Fall time of SCL signal | 20 + 0.1 CB | 1000 | ns |
| t(SDA-R) | Rise time of SDA signal | 20 + 0.1 CB | 1000 | ns |
| t(SDA-F) | Fall time of SDA signal | 20 + 0.1 CB | 1000 | ns |
| t(P-SU) | Setup time for STOP condition | 4 | μs | |
| CB | Capacitive load for SDA and SCL lines | 400 | pF | |
| VNH | Noise margin at high level for each connected device (including hysteresis) | 0.2 VDD | V | |
Figure 1. Interface Timing
Figure 2. Frequency Response (Sharp Roll-off)
Figure 4. Frequency Response (Slow Roll-off)
Figure 3. Passband Frequency Response (Sharp Roll-off)
Figure 5. Transition Characteristics (Slow Roll-off)
Figure 6. De-Emphasis
Figure 8. De-Emphasis
Figure 10. De-Emphasis
Figure 7. De-Emphasis Error
Figure 9. De-Emphasis Error
Figure 11. De-Emphasis Error
Figure 12. Analog Filter Performance
Figure 13. Total Harmonic Distortion + Noise vs Supply Voltage
Figure 15. Signal-to-Noise Ratio vs Supply Voltage
Figure 14. Dynamic Range vs Supply Voltage
Figure 16. Channel Separation vs Supply Voltage
Figure 17. Total Harmonic Distortion + Noise vs Temperature
Figure 19. Signal-to-Noise Ratio vs Temperature
Figure 18. Dynamic Range vs Temperature
Figure 20. Channel Separation vs Temperature