SBOS207C October   2001  – December 2015 PGA2310

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs and Outputs
      2. 7.3.2 Serial Control Port
      3. 7.3.3 Gain Settings
      4. 7.3.4 Daisy-Chaining Multiple PGA2310 Devices
      5. 7.3.5 Zero Crossing Detection
      6. 7.3.6 Mute Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Up State
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply Voltage VA+ 16 V
VA– –16
VD+ 6.5
Analog input voltage 0 VA+,VA– V
Digital input voltage –0.3 VD+ V
Operating temperature –55 125 °C
Junction temperature 150 °C
Lead temperature (soldering, 10 s) 300 °C
Package temperature (IR, reflow, 10 s) 235 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VA+ Positive analog power supply 4.5 15 15.5 V
VA– Negative analog power supply –4.5 –15 –15.5 V
VD+ Digital power supply 4.5 5 5.5 V
Operating temperature –55 25 125 °C

6.4 Thermal Information

THERMAL METRIC(1) PGA2310 UNIT
D (SOIC) P (PDIP)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 83 39.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 44 26.2 °C/W
RθJB Junction-to-board thermal resistance 40.5 20.1 °C/W
ψJT Junction-to-top characterization parameter 11.5 10.7 °C/W
ψJB Junction-to-board characterization parameter 40.2 19.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At TA = 25°C, VA+ = 15 V, VA− = −15 V, VD+ = 5 V, RL = 100 kΩ, CL = 20 pF, BW measure = 10 Hz to 20 kHz, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC CHARACTERISTICS
Step Size 0.5 dB
Gain Error Gain Setting = 31.5 dB ±0.05 dB
Gain Matching ±0.05 dB
Input Resistance 10 kΩ
Input Capacitance 7 pF
AC CHARACTERISTICS
THD+N VIN = 10 VPP, f = 1 kHz 0.0004% 0.001%
Dynamic Range VIN = AGND, Gain = 0 dB 116 120 dB
Voltage Range, Input and Output (VA−) + 1.5 (VA−) − 1.5 V
Output Noise VIN = AGND, Gain = 0 dB 9.5 13.5 μVRMS
Interchannel Crosstalk f = 1 kHz –126 dBFS
OUTPUT BUFFER
Offset Voltage VIN = AGND, Gain = 0 dB 0.5 3 mV
Load Capacitance Stability 1000 pF
Short-Circuit Current 35 mA
Unity-Gain Bandwidth, Small Signal 1.5 MHz
DIGITAL CHARACTERISTICS
High-Level Input Voltage, VIH 2 VD+ V
Low-Level Input Voltage, VIL –0.3 0.8 V
High-Level Output Voltage, VOH IO = 200 μA (VD+) − 1 V
Low-Level Output Voltage, VOL IO = –3.2 mA 0.4 V
Input Leakage Current 1 10 µA
SWITCHING CHARACTERISTICS
tSCLK Serial Clock (SCLK) Frequency 0 6.25 MHz
tPL Serial Clock (SCLK) Pulse Width Low 80 ns
tPH Serial Clock (SCLK) Pulse Width High 80 ns
tMI MUTE Pulse Width Low 2 ms
INPUT TIMING
tSDS SDI Setup Time 20 ns
tSDH SDI Hold Time 20 ns
tCSCR CS Falling to SCLK Rising 90 ns
tCFCS SCLK Falling to CS Rising 35 ns
OUTPUT TIMING
tCSO CS Low to SDO Active 35 ns
tCFDO SCLK Falling to SDO Data Valid 60 ns
tCSZ CS High to SDO High Impedance 100 ns
POWER SUPPLY
Operating Voltage VA+ 4.5 15 15.5 V
VA– –4.5 –15 –15.5
VD+ 4.5 5 5.5
Quiescent Current IA+ VA+ = 15 V 7.5 10 mA
IA– VA– = –15 V 7.7 10
ID+ VD+ = 5 V 0.8 1.5
TEMPERATURE RANGE
Specified Range –40 85 °C
Operating Range –55 125 °C

6.6 Typical Characteristics

At TA = 25°C, VA+ = 15 V, VA− = −15 V, VD+ = 5 V, RL = 100 kΩ, CL = 20 pF, BW measure = 10 Hz to 20 kHz, unless otherwise noted.
PGA2310 sbos207_typchar_1.gif
Figure 1. Frequency Response
PGA2310 sbos207_typchar_3.gif
Figure 3. THD+N vs Frequency
(VIN = 3 VRMS, Load = 100 kΩ)
PGA2310 sbos207_typchar_5.gif
Figure 5. THD+N vs Frequency
(VIN = 8.5 VRMS, Load = 100 kΩ)
PGA2310 sbos207_typchar_7.gif
Figure 7. Amplitude vs Frequency
(Crosstalk With fIN = 1 kHz)
PGA2310 sbos207_typchar_9.gif
Figure 9. Amplitude vs Frequency
(Crosstalk With fIN = 20 kHz)
PGA2310 sbos207_typchar_2.gif
Figure 2. THD+N vs Amplitude
PGA2310 sbos207_typchar_4.gif
Figure 4. THD+N vs Frequency
(VIN = 3 VRMS, Load = 600 kΩ)
PGA2310 sbos207_typchar_6.gif
Figure 6. THD+N vs Frequency
(VIN = 8.5 VRMS, Load = 600 kΩ)
PGA2310 sbos207_typchar_8.gif
Figure 8. Amplitude vs Frequency
(Crosstalk with fIN = 10 kHz)