SBVS058D June   2005  – April 2026 REF3212 , REF3220 , REF3225 , REF3230 , REF3233 , REF3240

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Electrical Characteristics
    4. 5.4 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Supply Voltage
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Thermal Hysteresis
      2. 6.3.2 Temperature Drift
      3. 6.3.3 Noise Performance
      4. 6.3.4 Load Regulation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Long-Term Stability
    2. 7.2 Typical Application
      1. 7.2.1 Detailed Design Procedure
        1. 7.2.1.1 Negative Reference Voltage
        2. 7.2.1.2 Data Acquisition
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.