SBOS747C May   2016  – July 2026 REF61

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-A787C102-7D46-49D3-80D0-980BFF94C990/SBOS600118
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Thermal Hysteresis
    3. 7.3 Reference Droop Measurements
    4. 7.4 1/f Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Integrated ADC Drive Buffer
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Load Current
      4. 8.3.4 Stability
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Results
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Load Current

The REF6125, REF6130, REF6133 and REF6141 are specified to deliver current load of ±4mA. The REF6145 is specified to deliver ±3.5mA, and the REF6150 is specified to deliver ±3mA. The REF61xx are protected from short circuits at the output by limiting the output short-circuit current.

The short-circuit current limit (ISC) of the REF61xx family of devices is adjusted by connecting a resistor (RSS) on the SS pin. The short-circuit current limit when the REF61xx device is sourcing current can be calculated as shown in Equation 4:

Equation 4. REF61

The short circuit current limit when the REF61xx device is sinking is calculated as shown in Equation 5:

Equation 5. REF61

The recommended output current of the REF61xx also depends on the resistor connected to the SS pin. The recommended output current (sourcing and sinking) for the REF6125, REF6130, REF6133 and REF6141 is given by Equation 6:

Equation 6. REF61

The recommended output current (sourcing and sinking) for the REF6145 is given by Equation 7:

Equation 7. REF61

The recommended output current (sourcing and sinking) for the REF6150 is given by Equation 8:

Equation 8. REF61

The temperature of the device increases according to Equation 9:

Equation 9. REF61

where:

  • TJ = junction temperature (°C).
  • TA = ambient temperature (°C).
  • PD = power dissipated (W).
  • RθJA = junction-to-ambient thermal resistance (°C/W).

The REF61xx maximum junction temperature must not exceed the absolute maximum rating of 150°C.