SBOS747B May   2016  – August 2016 REF6125 , REF6130 , REF6133 , REF6141 , REF6145 , REF6150

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Reference Droop comparison (1 LSB = 19.07 µV, With ADS8881 at 1 MSPS)
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Thermal Hysteresis
    3. 8.3 Reference Droop Measurements
    4. 8.4 1/f Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Integrated ADC Drive Buffer
      2. 9.3.2 Temperature Drift
      3. 9.3.3 Load Current
      4. 9.3.4 Stability
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Results
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.3 Load Current

The REF6125, REF6130, REF6133 and REF6141 are specified to deliver current load of ±4 mA. The REF6145 is specified to deliver ±3.5 mA, and the REF6150 is specified to deliver ±3 mA. The REF61xx are protected from short circuits at the output by limiting the output short-circuit current.

The short-circuit current limit (ISC) of the REF61xx family of devices is adjusted by connecting a resistor (RSS) on the SS pin. The short-circuit current limit when the REF61xx device is sourcing current can be calculated as shown in Equation 4:

Equation 4. REF6125 REF6130 REF6133 REF6141 REF6145 REF6150 Eq1_BOS708.gif

The short circuit current limit when the REF61xx device is sinking is calculated as shown in Equation 5:

Equation 5. REF6125 REF6130 REF6133 REF6141 REF6145 REF6150 Eq2_BOS708.gif

The recommended output current of the REF61xx also depends on the resistor connected to the SS pin. The recommended output current (sourcing and sinking) for the REF6125, REF6130, REF6133 and REF6141 is given by Equation 6:

Equation 6. REF6125 REF6130 REF6133 REF6141 REF6145 REF6150 Eq3_BOS708.gif

The recommended output current (sourcing and sinking) for the REF6145 is given by Equation 7:

Equation 7. REF6125 REF6130 REF6133 REF6141 REF6145 REF6150 Eq4_BOS708.gif

The recommended output current (sourcing and sinking) for the REF6150 is given by Equation 8:

Equation 8. REF6125 REF6130 REF6133 REF6141 REF6145 REF6150 Eq5_BOS708.gif

The temperature of the device increases according to Equation 9:

Equation 9. REF6125 REF6130 REF6133 REF6141 REF6145 REF6150 q_pwr-diss_bos600.gif

where

  • TJ = junction temperature (°C).
  • TA = ambient temperature (°C).
  • PD = power dissipated (W).
  • RθJA = junction-to-ambient thermal resistance (°C/W).

The REF61xx maximum junction temperature must not exceed the absolute maximum rating of 150°C.