SLAS740A January   2013  – October 2015 RF430F5978


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Characteristics
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics - Active Mode Supply Currents
    6. 5.6  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    7. 5.7  Typical Characteristics - Low-Power Mode Supply Currents
    8. 5.8  Thermal Resistance Characteristics
    9. 5.9  Digital Inputs
    10. 5.10 Digital Outputs
    11. 5.11 Typical Characteristics - Outputs, Reduced Drive Strength (PxDS.y = 0)
    12. 5.12 Typical Characteristics - Outputs, Full Drive Strength (PxDS.y = 1)
    13. 5.13 Crystal Oscillator, XT1, Low-Frequency Mode
    14. 5.14 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    15. 5.15 Internal Reference, Low-Frequency Oscillator (REFO)
    16. 5.16 DCO Frequency
    17. 5.17 PMM, Brown-Out Reset (BOR)
    18. 5.18 PMM, Core Voltage
    19. 5.19 PMM, SVS High Side
    20. 5.20 PMM, SVM High Side
    21. 5.21 PMM, SVS Low Side
    22. 5.22 PMM, SVM Low Side
    23. 5.23 Wake-up Times From Low-Power Modes and Reset
    24. 5.24 Timer_A
    25. 5.25 USCI (UART Mode) Clock Frequency
    26. 5.26 USCI (UART Mode)
    27. 5.27 USCI (SPI Master Mode) Clock Frequency
    28. 5.28 USCI (SPI Master Mode)
    29. 5.29 USCI (SPI Slave Mode)
    30. 5.30 USCI (I2C Mode)
    31. 5.31 12-Bit ADC, Power Supply and Input Range Conditions
    32. 5.32 12-Bit ADC, Timing Parameters
    33. 5.33 12-Bit ADC, Linearity Parameters
    34. 5.34 12-Bit ADC, Temperature Sensor and Built-In VMID
    35. 5.35 REF, External Reference
    36. 5.36 REF, Built-In Reference
    37. 5.37 Comparator B
    38. 5.38 Flash Memory
    39. 5.39 JTAG and Spy-Bi-Wire Interface
    40. 5.40 RF1A CC1101 Radio Parameters
      1. 5.40.1  RF Crystal Oscillator, XT2
      2. 5.40.2  Current Consumption, Reduced-Power Modes
      3. 5.40.3  Current Consumption, Receive Mode
      4. 5.40.4  Current Consumption, Transmit Mode
      5. 5.40.5  Typical TX Current Consumption, 315 MHz
      6. 5.40.6  Typical TX Current Consumption, 433 MHz
      7. 5.40.7  Typical TX Current Consumption, 868 MHz
      8. 5.40.8  Typical TX Current Consumption, 915 MHz
      9. 5.40.9  RF Receive, Overall
      10. 5.40.10 RF Receive, 315 MHz
      11. 5.40.11 RF Receive, 433 MHz
      12. 5.40.12 RF Receive, 868 or 915 MHz
      13. 5.40.13 Typical Sensitivity, 315 MHz, Sensitivity-Optimized Setting
      14. 5.40.14 Typical Sensitivity, 433 MHz, Sensitivity-Optimized Setting
      15. 5.40.15 Typical Sensitivity, 868 MHz, Sensitivity-Optimized Setting
      16. 5.40.16 Typical Sensitivity, 915 MHz, Sensitivity-Optimized Setting
      17. 5.40.17 RF Transmit
      18. 5.40.18 Optimum PATABLE Settings for Various Output Power Levels and Frequency Bands
      19. 5.40.19 Typical Output Power, 315 MHz
      20. 5.40.20 Typical Output Power, 433 MHz
      21. 5.40.21 Typical Output Power, 868 MHz
      22. 5.40.22 Typical Output Power, 915 MHz
      23. 5.40.23 Frequency Synthesizer Characteristics
      24. 5.40.24 Typical RSSI_offset Values
    41. 5.41 3D LF Front-End Parameters
      1. 5.41.1 Recommended Operating Conditions
      2. 5.41.2 Resonant Circuits - LF Front End
      3. 5.41.3 External Antenna Coil - LF Front End
      4. 5.41.4 Resonant Circuit Capacitor - LF Front End
      5. 5.41.5 Charge Capacitor - LF Front End
      6. 5.41.6 LF Wake Receiver Electrical Characteristics
      7. 5.41.7 RSSI - LF Wake Receiver Electrical Characteristics
  6. 6Detailed Description
    1. 6.1  3D LF Wake Receiver and 3D Transponder Interface
      1. 6.1.1 3D LF Front End
      2. 6.1.2 EEPROM
      3. 6.1.3 Switch Interface
    2. 6.2  Sub-1-GHz Radio
    3. 6.3  CPU
    4. 6.4  Operating Modes
    5. 6.5  Interrupt Vector Addresses
    6. 6.6  Memory Organization
    7. 6.7  Bootloader (BSL)
    8. 6.8  JTAG Operation
      1. 6.8.1 JTAG Standard Interface
      2. 6.8.2 Spy-Bi-Wire Interface
    9. 6.9  Flash Memory
    10. 6.10 RAM
    11. 6.11 Peripherals
      1. 6.11.1  Oscillator and System Clock
      2. 6.11.2  Power-Management Module (PMM)
      3. 6.11.3  Digital I/O
      4. 6.11.4  Port Mapping Controller
      5. 6.11.5  System (SYS) Module
      6. 6.11.6  DMA Controller
      7. 6.11.7  Watchdog Timer (WDT_A)
      8. 6.11.8  CRC16
      9. 6.11.9  Hardware Multiplier
      10. 6.11.10 AES128 Accelerator
      11. 6.11.11 Universal Serial Communication Interface (USCI)
      12. 6.11.12 TA0
      13. 6.11.13 TA1
      14. 6.11.14 Real-Time Clock (RTC_A)
      15. 6.11.15 REF Voltage Reference
      16. 6.11.16 Comparator_B
      17. 6.11.17 ADC12_A
      18. 6.11.18 Embedded Emulation Module (EEM) (S Version)
      19. 6.11.19 Peripheral File Map
    12. 6.12 Input/Output Schematics
      1. 6.12.1  Port P1, P1.0 to P1.4, Input/Output With Schmitt Trigger
      2. 6.12.2  Port P1, P1.5 to P1.7, Input/Output With Schmitt Trigger
      3. 6.12.3  Port P2, P2.0 to P2.2, Input/Output With Schmitt Trigger
      4. 6.12.4  Port P2, P2.4 and P2.5, Input/Output With Schmitt Trigger
      5. 6.12.5  Port P3, P3.1 to P3.3, P3.5, and P3.7, Input/Output With Schmitt Trigger
      6. 6.12.6  Port P4, P4.0 to P4.2, Input/Output With Schmitt Trigger
      7. 6.12.7  Port P5, P5.0, Input/Output With Schmitt Trigger
      8. 6.12.8  Port P5, P5.1, Input/Output With Schmitt Trigger
      9. 6.12.9  Port J, J.0 JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      10. 6.12.10 Port J, J.1 to J.3 JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    13. 6.13 Device Descriptor Structures
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Circuit
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. Getting Started and Next Steps
      2. 8.1.2 Device and Development Tool Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Export Control Notice
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Device and Documentation Support

8.1 Device Support

8.1.1 Development Support Getting Started and Next Steps

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the RF430F5978 device applications:

Software Development Tools: Code Composer Studio Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools.

Hardware Development Tools: For a complete listing of development-support tools for the RF430F5978 platform, visit the TI website at For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

8.1.2 Device and Development Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all RF430 MCU devices and support tools. Each commercial family member has one of three prefixes: RF, P, or X (for example, RF430F5978). TI recommends two of three possible prefix designators for its support tools: RF and X. These prefixes represent evolutionary stages of product development from engineering prototypes (with X for devices and tools) through fully qualified production devices and tools (with RF for devices tools).

Device development evolutionary flow:

X – Experimental device that is not necessarily representative of the electrical specifications of the final device

P – Silicon die that conforms to the electrical specifications of the final device but has not completed quality and reliability verification

RF – Fully qualified production device

Support tool development evolutionary flow:

X – Development-support product that has not yet completed TI's internal qualification testing.

RF – Fully-qualified development-support product

X and P devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

RF devices and RF development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X and P) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGC) and temperature range (for example, I). Figure 8-1 provides a legend for reading the complete device name for any family member.

RF430F5978 Part_Number_Decoder_RF430F5978.gif Figure 8-1 Device Nomenclature

8.2 Documentation Support

8.2.1 Related Documentation

The following documents describe the RF430F5978 SoC. Copies of these documents are available on the Internet at

    SLAU378 RF430 Family User's Guide. Detailed descriptions of all of the modules available in this device family.

8.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.

TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded processors from TI and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

8.4 Trademarks

MSP430, Code Composer Studio, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.6 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

8.7 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms and definitions.