SGUS034F February   2001  – June 2015 SMJ320VC33

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description (continued)
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Electrical Characteristics
    4. 6.4  Phase-Locked Loop Characteristics Using EXTCLK or On-Chip Crystal Oscillator Timing Requirements
    5. 6.5  Circuit Parameters for On-Chip Crystal Oscillator Timing Requirements
    6. 6.6  Timing Requirements for EXTCLK, All Modes
    7. 6.7  Timing Requirements for Memory Read/Write for STRB
    8. 6.8  Timing Requirements for XF0 and XF1 when Executing LDFI or LDII
    9. 6.9  Timing Requirements for XF0 and XF1 when Executing SIGI
    10. 6.10 Timing Requirements for Changing XFx from Output to Input Mode
    11. 6.11 Timing Requirements for RESET
    12. 6.12 Timing Requirements for INT3 to INT0 Response
    13. 6.13 Timing Requirements for Serial Port
    14. 6.14 Timing Requirements for HOLD/HOLDA
    15. 6.15 Timing Requirements for Peripheral Pin General-Purpose I/O
    16. 6.16 Timing Requirements for Timer Pin
    17. 6.17 Timing Requirements for IEEE-1149.1 Test Access Port
    18. 6.18 Switching Characteristics for EXTCLK, All Modes
    19. 6.19 Switching Characteristics for Memory Read/Write for STRB
    20. 6.20 Switching Characteristics for XF0 and XF1 when Executing LDFI or LDII
    21. 6.21 Switching Characteristics for XF0 when Executing STFI or STII
    22. 6.22 Switching Characteristics for XF0 and XF1 when Executing SIGI
    23. 6.23 Switching Characteristics for Loading when XF is Configured as an Output
    24. 6.24 Switching Characteristics for Changing XFx from Output to Input Mode
    25. 6.25 Switching Characteristics for Changing XFx from an Input to an Output
    26. 6.26 Switching Characteristics for RESET
    27. 6.27 Switching Characteristics for IACK
    28. 6.28 Switching Characteristics for Serial Port
    29. 6.29 Switching Characteristics for HOLD/HOLDA
    30. 6.30 Switching Characteristics for Peripheral Pin General-Purpose I/O
    31. 6.31 Switching Characteristics for Timer Pin
    32. 6.32 Switching Characteristics for SHZ
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1  JTAG Scan-Based Emulation Logic
      2. 8.2.2  Clock Generator
      3. 8.2.3  PLL and Clock Oscillator Control
      4. 8.2.4  PLL Isolation
      5. 8.2.5  Clock and PLL Considerations on Initialization
      6. 8.2.6  EDGEMODE
      7. 8.2.7  Reset Operation
      8. 8.2.8  PAGE0 to PAGE3 Select Lines
      9. 8.2.9  Using External Logic With the READY Pin
      10. 8.2.10 Posted Writes
      11. 8.2.11 Data Bus I/O Buffer
      12. 8.2.12 Bootloader Operation
      13. 8.2.13 JTAG Emulation
      14. 8.2.14 Designing a Target System Emulator Connector (14-Pin Header)
      15. 8.2.15 JTAG Emulator Cable Pod Logic
      16. 8.2.16 Reset Timing
      17. 8.2.17 Interrupt Response TIming
      18. 8.2.18 Interrupt-Acknowledge Timing
      19. 8.2.19 Data-Rate Timing Modes
      20. 8.2.20 HOLD Timing
      21. 8.2.21 General-Purpose I/O Timing
      22. 8.2.22 Peripheral Pin I/O Timing
      23. 8.2.23 Timer Pin Timing
    3. 8.3 Register Maps
  9. 9 Power Supply Recommendations
    1. 9.1 Power Sequencing Considerations
  10. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Timing Parameter Symbology
      2. 10.2.2 Device and Development-Support Tool Nomenclature
    3. 10.3 Related Links
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HFG|164
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

10.2 Device Support

10.2.1 Timing Parameter Symbology

Timing parameter symbols used herein were created in accordance with JEDEC standard 100. To shorten the symbols, some of the pin names and other related terminology have been abbreviated as follows, unless otherwise noted:

Table 9. Timing Parameter Meanings

Symbols Meaning
A Address lines (A23- A0)
ASYNCH Asynchronous reset signals (XF0, XF1, CLKX0, DX0, FSX0, CLKR0, DR0, FSR0, TCLK0, and TCLK1)
CLKX CLKX0
CLKR CLKR0
CONTROL Control signals
D Data lines (D31 to D0)
DR DR
DX DX
EXTCLK EXTCLK
FS FSX/R
FSX FSX0
FSR FSR0
GPI General-purpose input
GPIO General-purpose input/output; peripheral pin (CLKX0, CLKR0, DX0, DR0, FSX0, FSR0, TCLK, and TCLK1)
GPO General-purpose output
H1 H1
H3 H3
H H1 and H3
HOLD HOLD
HOLDA HOLDA
IACK IACK
INT INT3 to INT0
PAGE PAGE0 to PAGE3
RDY RDY
RW R/W
RW R/W
RESET RESET
S STRB
SCK CLKX/R
SHZ SHZ
TCLK TCLK0, TCLK1, or TCLKx
XF XF0, XF1, or XFx
XF0 XF0
XF1 XF1
XIN XIN

10.2.2 Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all TMS320 DSP family devices and support tools. Each TMS320 DSP member has one of three prefixes: TMX, TMP, or TMS. TI recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully-qualified production devices/tools (TMS/TMDS).

Device development evolutionary flow:

SMX Experimental device that is not necessarily representative of the final device’s electrical specifications
TMP Final silicon die that conforms to the device’s electrical specifications but has not completed quality and reliability verification
SM/SMJ Fully-qualified production device

Support tool development evolutionary flow:

TMDX Development support product that has not yet completed TI internal qualification testing.
TMDS Fully qualified development support product

TMX and TMP devices and TMDX development support tools are shipped against the following disclaimer:

“Developmental product is intended for internal evaluation purposes.”

TMS devices and TMDS development support tools have been characterized fully, and the quality and reliability of the device has been demonstrated fully. TI’s standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, HFG, GNM, or GNL) and temperature range (for example, M). Figure 39 provides a legend for reading the complete device name for any TMS320 DSP family member.

SM320VC33 SMJ320VC33 DSP_device_nomen_SGUS034.gif
A. QFP = Quad flat package
LQFP = Low-profile quad flat package
BGA = Ball grid array
Figure 39. TMS320 DSP Device Nomenclature

10.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 10. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
SM320VC33 Click here Click here Click here Click here Click here
SMJ320VC33 Click here Click here Click here Click here Click here

10.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.5 Trademarks

TImeline, SM320C3x, E2E are trademarks of Texas Instruments.

DuPont is a trademark of E. I. du Pont de Nemours and Company.

All other trademarks are the property of their respective owners.

10.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

10.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.