SCLS376I June   1997  – March 2015 SN54AHC273 , SN74AHC273

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematics
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements, VCC = 3.3 V ± 0.3 V
    7. 7.7  Timing Requirements, VCC = 5 V ± 0.5 V
    8. 7.8  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    9. 7.9  Switching Characteristics, VCC = 5 V ± 0.5 V
    10. 7.10 Noise Characteristics
    11. 7.11 Operating Characteristics
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|20
  • J|20
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
VI Input voltage range(2) –0.5 7 V
VO Output voltage range(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±25 mA
Continuous current through VCC or GND ±75 mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 0 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 0 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN54AHC273 SN74AHC273 UNIT
MIN MAX MIN MAX
VCC Supply voltage 2 5.5 2 5.5 V
VIH High-level input voltage VCC = 2 V 1.5 1.5 V
VCC = 3 V 2.1 2.1
VCC = 5.5 V 3.85 3.85
VIL Low-level input voltage VCC = 2 V 0.5 0.5 V
VCC = 3 V 0.9 0.9
VCC = 5.5 V 1.65 1.65
VI Input voltage 0 5.5 0 5.5 V
VO Output voltage 0 VCC 0 VCC V
IOH High-level output current VCC = 2 V –50 –50 µA
VCC = 3 V ± 0.3 V –4 –4 mA
VCC = 5.5 V ± 0.5 V –8 –8
IOL Low-level output current VCC = 2 V 50 50 µA
VCC = 3 V ± 0.3 V 4 4 mA
VCC = 5.5 V ± 0.5 V 8 8
∆t/∆v Input transition rise and fall time VCC = 3 V ± 0.3 V 100 100 ns/V
VCC = 5.5 V ± 0.5 V 20 20
TA Operating free-air temperature –55 125 –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, (SCBA004).

7.4 Thermal Information

THERMAL METRIC(1) SN74AHC273 UNIT
N DW NS DB PW DGV
20 PINS
RθJA Junction-to-ambient thermal resistance 53.9 81.8 79.4 98.7 104.7 118.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.8 47.8 45.9 60.4 38.8 33.4
RθJB Junction-to-board thermal resistance 34.7 49.4 46.9 56.9 55.7 59.6
ψJT Junction-to-top characterization parameter 26.9 20.1 19.1 21.6 2.9 1.1
ψJB Junction-to-board characterization parameter 34.7 49.0 46.5 53.5 55.1 58.9
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a n/a
(1) For more information about traditional and new thermal metrics, see the TI application report IC Package Thermal Metrics (SPRA953).

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C SN54AHC273 SN74AHC273 UNIT
MIN TYP MAX MIN MAX MIN MAX
VOH IOH = –50 µA 2 V 1.9 1.9 1.9 V
3 V 2.9 2.9 2.9
4.5 V 4.4 4.4 4.4
IOH = –4 mA 3 V 2.58 2.48 2.48
IOH = –8 mA 4.5 V 3.94 3.8 3.8
VOL IOL = 50 µA 2 V 0.1 0.1 0.1 V
3 V 0.1 0.1 0.1
4.5 V 0.1 0.1 0.1
IOL = 4 mA 3 V 0.36 0.5 0.44
IOL = 8 mA 4.5 V 0.36 0.5 0.44
II VI = 5.5 V or GND 0 to 5.5 V ±0.1 ±1(1) ±1 µA
ICC VI = VCC or GND IO = 0 5.5 V 4 40 40 µA
Ci VI = VCC or GND 5 V 2.5 10 10 pF
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.

7.6 Timing Requirements, VCC = 3.3 V ± 0.3 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
SN54AHC273 SN74AHC273 UNIT
TA = 25°C MIN MAX TA = 25°C MIN MAX
MIN MAX MIN MAX
tw Pulse Duration CLR low 5 6 5 6 ns
CLK high or low 5 6.5 5 6.5
tsu Setup time Data before CLK↑ 5.5 6.5 5.5 6.5 ns
CLR before CLK↑ 2.5 2.5 2.5 2.5
th Hold time, data after CLK↑ 1.5 2 1 1 ns

7.7 Timing Requirements, VCC = 5 V ± 0.5 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
SN54AHC273 SN74AHC273 UNIT
TA = 25°C MIN MAX TA = 25°C MIN MAX
MIN MAX MIN MAX
tw Pulse Duration CLR low 5 5 5 5 ns
CLK high or low 5 5 5 5
tsu Setup time Data before CLK↑ 4.5 4.5 4.5 4.5 ns
CLR before CLK↑ 2 2 2 2
th Hold time, data after CLK↑ 1.5 2 1 1 ns

7.8 Switching Characteristics, VCC = 3.3 V ± 0.3 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 LOAD
CAPACITANCE		 TA = 25°C SN54AHC273 SN74AHC273 UNIT
MIN TYP MAX MIN MAX MIN MAX
fmax CL = 15 pF 75(1) 120(1) 65(1) 65 MHz
CL = 50 pF 50 75 45 45
tPHL CLR Q CL = 15 pF 8.9(1) 13.6(1) 1(1) 16(1) 1 16 ns
tPLH CKL Q CL = 15 pF 8.7(1) 13.6(1) 1(1) 16(1) 1 16
tPHL 8.7(1) 13.6(1) 1(1) 16(1) 1 16 ns
tPHL CLR Q CL = 50 pF 11.4 17.1 1 19.5 1 19.5
tPLH CLK Q CL = 50 pF 11.2 17.1 1 19.5 1 19.5 ns
tPHL 11.2 17.1 1 19.5 1 19.5 ns
tsk(o) CL = 50 pF 1.5(2) 1.5 ns
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(2) On products compliant to MIL-PRF-38535, this parameter does not apply.

7.9 Switching Characteristics, VCC = 5 V ± 0.5 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 LOAD
CAPACITANCE		 TA = 25°C SN54AHC273 SN74AHC273 UNIT
MIN TYP MAX MIN MAX MIN MAX
fmax CL = 15 pF 120(1) 165(1) 100(1) 100 MHz
CL = 50 pF 80 110 70 70
tPHL CLR Q CL = 15 pF 5.2(1) 8.5(1) 1(1) 10(1) 1 10 ns
tPLH CKL Q CL = 15 pF 5.8(1) 9(1) 1(1) 10.5(1) 1 10.5
tPHL 5.8(1) 9(1) 1(1) 10.5(1) 1 10.5 ns
tPHL CLR Q CL = 50 pF 6.7 10.5 1 12 1 12
tPLH CLK Q CL = 50 pF 7.3 11 1 12.5 1 12.5 ns
tPHL 7.3 11 1 12.5 1 12.5 ns
tsk(o) CL = 50 pF 1(2) 1 ns
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(2) On products compliant to MIL-PRF-38535, this parameter does not apply.

7.10 Noise Characteristics(1)

VCC = 5 V, CL = 50 pF, TA = 25°C
PARAMETER SN74AHC273 UNIT
MIN TYP MAX
VOL(P) Quiet output, maximum dynamic VOL 0.7 V
VOL(V) Quiet output, minimum dynamic VOL –0.7 V
VOH(V) Quiet output, minimum dynamic VOH 4.7 V
VIH(D) High-level dynamic input voltage 3.5 V
VIL(D) Low-level dynamic input voltage 1.5 V
(1) Characteristics are for surface-mount packages only.

7.11 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 31 pF

7.12 Typical Characteristics

SN54AHC273 SN74AHC273 D001_SCLS376.gifFigure 1. TPD vs VCC
SN54AHC273 SN74AHC273 D002_SCLS376.gifFigure 2. TPD vs Temperature