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Product details

Parameters

Number of channels (#) 8 Technology Family AHC Supply voltage (Min) (V) 2 Supply voltage (Max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock Frequency (Max) (MHz) 110 IOL (Max) (mA) 8 IOH (Max) (mA) -8 ICC (Max) (uA) 40 Features Balanced outputs, High speed (tpd 10-50ns), Over-voltage tolerant inputs open-in-new Find other D-type flip-flops

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 42 mm² 6.5 x 6.4 TVSOP (DGV) 20 32 mm² 5 x 6.4 open-in-new Find other D-type flip-flops

Features

  • Operating Range 2-V to 5.5-V VCC
  • Contain Eight Flip-Flops With Single-Rail Outputs
  • Direct Clear Input
  • Individual Data Input to Each Flip-Flop
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)
  • On Products Compliant to MIL-PRF-38535,
    All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters.
open-in-new Find other D-type flip-flops

Description

These devices are positive-edge-triggered D-type
flip-flops with a direct clear (CLR) input.

Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the D input has no effect at the output.

open-in-new Find other D-type flip-flops
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Technical documentation

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Type Title Date
* Data sheet SNx4AHC273 Octal D-Type Flip-Flops With Clear datasheet (Rev. I) Mar. 11, 2015
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) Jul. 26, 2021
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application note Power-Up Behavior of Clocked Devices (Rev. A) Feb. 06, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) Dec. 02, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) Feb. 24, 2000
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) Sep. 08, 1999
More literature Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) Apr. 01, 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Live Insertion Oct. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

CAD/CAE symbols

Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options
TVSOP (DGV) 20 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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