SLLSEW9A December   2016  – June 2018 SN65DSI84-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clock Configurations and Multipliers
      2. 8.3.2 ULPS
      3. 8.3.3 LVDS Pattern Generation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Reset Implementation
      2. 8.4.2 Initialization Sequence
      3. 8.4.3 LVDS Output Formats
      4. 8.4.4 DSI Lane Merging
      5. 8.4.5 DSI Pixel Stream Packets
      6. 8.4.6 DSI Video Transmission Specifications
      7. 8.4.7 Operating Modes
    5. 8.5 Programming
      1. 8.5.1 Local I2C Interface Overview
    6. 8.6 Register Maps
      1. 8.6.1 Control and Status Registers Overview
        1. 8.6.1.1 CSR Bit Field Definitions – ID Registers
          1. 8.6.1.1.1 Registers 0x00 – 0x08
            1. Table 5. Registers 0x00 – 0x08 Field Descriptions
        2. 8.6.1.2 CSR Bit Field Definitions – Reset and Clock Registers
          1. 8.6.1.2.1 Register 0x09
            1. Table 6. Register 0x09 Field Descriptions
          2. 8.6.1.2.2 Register 0x0A
            1. Table 7. Register 0x0A Field Descriptions
          3. 8.6.1.2.3 Register 0x0B
            1. Table 8. Register 0x0B Field Descriptions
          4. 8.6.1.2.4 Register 0x0D
            1. Table 9. Register 0x0D Field Descriptions
        3. 8.6.1.3 CSR Bit Field Definitions – DSI Registers
          1. 8.6.1.3.1 Register 0x10
            1. Table 10. Register 0x10 Field Descriptions
          2. 8.6.1.3.2 Register 0x11
            1. Table 11. Register 0x11 Field Descriptions
          3. 8.6.1.3.3 Register 0x12
            1. Table 12. Register 0x12 Field Descriptions
        4. 8.6.1.4 CSR Bit Field Definitions – LVDS Registers
          1. 8.6.1.4.1 Register 0x18
            1. Table 13. Register 0x18 Field Descriptions
          2. 8.6.1.4.2 Register 0x19
            1. Table 14. Register 0x19 Field Descriptions
          3. 8.6.1.4.3 Register 0x1A
            1. Table 15. Register 0x1A Field Descriptions
          4. 8.6.1.4.4 Register 0x1B
            1. Table 16. Register 0x1B Field Descriptions
        5. 8.6.1.5 CSR Bit Field Definitions – Video Registers
          1. 8.6.1.5.1  Register 0x20
            1. Table 17. Register 0x20 Field Descriptions
          2. 8.6.1.5.2  Register 0x21
            1. Table 18. Register 0x21 Field Descriptions
          3. 8.6.1.5.3  Register 0x24
            1. Table 19. Register 0x24 Field Descriptions
          4. 8.6.1.5.4  Register 0x25
            1. Table 20. Register 0x25 Field Descriptions
          5. 8.6.1.5.5  Register 0x28
            1. Table 21. Register 0x28 Field Descriptions
          6. 8.6.1.5.6  Register 0x29
            1. Table 22. Register 0x29 Field Descriptions
          7. 8.6.1.5.7  Register 0x2C
            1. Table 23. Register 0x2C Field Descriptions
          8. 8.6.1.5.8  Register 0x2D
            1. Table 24. Register 0x2D Field Descriptions
          9. 8.6.1.5.9  Register 0x30
            1. Table 25. Register 0x30 Field Descriptions
          10. 8.6.1.5.10 Register 0x31
            1. Table 26. Register 0x31 Field Descriptions
          11. 8.6.1.5.11 Register 0x34
            1. Table 27. Register 0x34 Field Descriptions
          12. 8.6.1.5.12 Register 0x36
            1. Table 28. Register 0x36 Field Descriptions
          13. 8.6.1.5.13 Register 0x38
            1. Table 29. Register 0x38 Field Descriptions
          14. 8.6.1.5.14 Register 0x3A
            1. Table 30. Register 0x3A Field Descriptions
          15. 8.6.1.5.15 Register 0x3C
            1. Table 31. Register 0x3C Field Descriptions
        6. 8.6.1.6 CSR Bit Field Definitions – IRQ Registers
          1. 8.6.1.6.1 Register 0xE0
            1. Table 32. Register 0xE0 Field Descriptions
          2. 8.6.1.6.2 Register 0xE1
            1. Table 33. Register 0xE1 Field Descriptions
          3. 8.6.1.6.3 Register 0xE5
            1. Table 34. Register 0xE5 Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Video Stop and Restart Sequence
      2. 9.1.2 Reverse LVDS Pin Order Option
      3. 9.1.3 IRQ Usage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Example Script
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 VCC Power Supply
    2. 10.2 VCORE Power Supply
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Package Specific
      2. 11.1.2 Differential Pairs
      3. 11.1.3 Ground
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VIL Low-level control signal input voltage 0.3 × VCC V
VIH High-level control signal input voltage 0.7 × VCC V
VOH High-level output voltage IOH = –4 mA 1.25 V
VOL Low-level output voltage IOL = 4 mA 0.4 V
ILKG Input failsafe leakage current VCC = 0; VCC(PIN) = 1.8 V ±30 μA
IIH High level input current Any input terminal ±30 μA
IIL Low level input current Any input terminal ±30 μA
IOZ High-impedance output current CMOS output terminals ±10 μA
IOS Short-circuit output current Any output driving GND short ±50 mA
ICC Device active current See (2) 106 164 mA
IULPS Device standby current All data and clock lanes are in ultra-low power state (ULPS) 7.7 14 mA
IRST Shutdown current EN = 0 0.04 130 µA
REN EN control input resistor 200 kΩ
MIPI DSI INTERFACE
VIH-LP LP receiver input high threshold See Figure 1 880 mV
VIL-LP LP receiver input low threshold See Figure 1 550 mV
|VID| HS differential input voltage 100 270 mV
|VIDT| HS differential input voltage threshold 50 mV
VIL-ULPS LP receiver input low threshold; ultra-low power state (ULPS) 300 mV
VCM-HS HS common mode voltage; steady-state 70 330 mV
ΔVCM-HS HS common mode peak-to-peak variation including symbol delta and interference 100 mV
VIH-HS HS single-ended input high voltage See Figure 1 460 mV
VIL-HS HS single-ended input low voltage See Figure 1 –40 mV
VTERM-EN HS termination enable; single-ended input voltage (both Dp AND Dn apply to enable) Termination is switched simultaneous for Dn and Dp 450 mV
RDIFF-HS HS mode differential input impedance 80 125 Ω
LVDS OUTPUT
|VOD| Steady-state differential output voltage for
A_Yx P/N and B_Yx P/N		 CSR 0x19.3:2=00 and, or CSR 0x19.1:0=00
100 Ω near end termination		 180 245 330 mV
CSR 0x19.3:2=01 and, or CSR 0x19.1:0=01
100 Ω near end termination		 215 293 392
CSR 0x19.3:2=10 and, or CSR 0x19.1:0=10
100 Ω near end termination		 250 341 455
CSR 0x19.3:2=11 and, or CSR 0x19.1:0=11
100 Ω near end termination		 290 389 515
CSR 0x19.3:2=00 and, or CSR 0x19.1:0=00
200 Ω near end termination		 150 204 275
CSR 0x19.3:2=01 and, or CSR 0x19.1:0=01
200 Ω near end termination		 200 271 365
CSR 0x19.3:2=10 and, or CSR 0x19.1:0=10
200 Ω near end termination		 250 337 450
CSR 0x19.3:2=11 and, or CSR 0x19.1:0=11
200 Ω near end termination		 300 402 535
|VOD| Steady-state differential output voltage for
A_CLKP/N and B_CLKP/N		 CSR 0x19.3:2=00 and, or CSR 0x19.1:0=00
100 Ω near end termination		 140 191 262 mV
CSR 0x19.3:2=01 and, or CSR 0x19.1:0=01
100 Ω near end termination		 168 229 315
CSR 0x19.3:2=10 and, or CSR 0x19.1:0=10
100 Ω near end termination		 195 266 365
CSR 0x19.3:2=11 and, or CSR 0x19.1:0=11
100 Ω near end termination		 226 303 415
CSR 0x19.3:2=00 and, or CSR 0x19.1:0=00
200 Ω near end termination		 117 159 220
CSR 0x19.3:2=01 and, or CSR 0x19.1:0=01
200 Ω near end termination		 156 211 295
CSR 0x19.3:2=10 and, or CSR 0x19.1:0=10
200 Ω near end termination		 195 263 362
CSR 0x19.3:2=11 and, or CSR 0x19.1:0=11
200 Ω near end termination		 234 314 435
Δ|VOD| Change in steady-state differential output voltage between opposite binary states RL = 100 Ω 35 mV
VOC(SS) Steady state common-mode output voltage(3) CSR 0x19.6 = 1 and CSR 0x1B.6 = 1; and, or CSR 0x19.4 = 1 and
CSR 0x1B.4 = 1; see Figure 2 		0.75 0.9 1.13 V
CSR 0x19.6 = 0 and, or CSR 0x19.4 = 0; see Figure 2 1 1.25 1.5
VOC(PP) Peak-to-peak common-mode output voltage see Figure 2 35 mV
RLVDS_DIS Pulldown resistance for disabled LVDS outputs 1 kΩ
(1) All typical values are at VCC = 1.8V and TA = 25°C
(2) SN65DSI84-Q1: SINGLE Channel DSI to DUAL Channel LVDS, 1400 x 900
  • number of LVDS lanes = 2 × (3 data lanes + 1 CLK lane)
  • number of DSI lanes = 2 data lanes + 1 CLK lane
  • LVDS CLK OUT = 53.25 M
  • DSI CLK = 500 M
  • RGB888, LVDS18 bpp
Maximum values are at VCC = 1.95 V and TA = 105°C
(3) Tested at VCC = 1.8V , TA = –40°C for MIN, TA = 25°C for TYP, TA = 105°C for MAX.