SN65DSI84-Q1

ACTIVE

Product details

Protocols LVDS, MIPI DSI Speed (Max) (Gbps) 4 Supply voltage (V) 1.8 Operating temperature range (C) -40 to 105
Protocols LVDS, MIPI DSI Speed (Max) (Gbps) 4 Supply voltage (V) 1.8 Operating temperature range (C) -40 to 105
HTQFP (PAP) 64 100 mm² 10 x 10
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature
    • Device HBM ESD Classification Level 3A
    • Device CDM ESD Classification Level C6
  • Implements MIPI D-PHY Version 1.00.00 Physical Layer Front-End and Display Serial Interface (DSI) Version 1.02.00
  • Single-Channel DSI Receiver Configurable for One, Two, Three, or Four D-PHY Data Lanes Per Channel Operating up to 1 Gbps Per Lane
  • Supports 18-bpp and 24-bpp DSI Video Packets with RGB666 and RGB888 Formats
  • Suitable for 60-fps WUXGA 1920 × 1200 Resolution at 18-bpp and 24-bpp Color, and 60-fps 1366 × 768 Resolution at 18-bpp and 24-bpp
  • Output Configurable for Single-Link or Dual-Link LVDS
  • Supports Single-Channel DSI to Dual-Link LVDS Operating Mode
  • LVDS Output-Clock Range of 25 MHz to 154 MHz in Dual-Link or Single-Link Mode
  • LVDS Pixel Clock May be Sourced from Free-Running Continuous D-PHY Clock or External Reference Clock (REFCLK)
  • 1.8 V Main VCC Power Supply
  • Low Power Features Include SHUTDOWN Mode, Reduced LVDS Output Voltage Swing, Common Mode, and MIPI Ultra-Low Power State (ULPS) Support
  • LVDS Channel SWAP, LVDS PIN Order Reverse Feature for Ease of PCB Routing
  • Packaged in 64-pin 10 mm × 10 mm HTQFP (PAP) PowerPAD™ IC Package
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature
    • Device HBM ESD Classification Level 3A
    • Device CDM ESD Classification Level C6
  • Implements MIPI D-PHY Version 1.00.00 Physical Layer Front-End and Display Serial Interface (DSI) Version 1.02.00
  • Single-Channel DSI Receiver Configurable for One, Two, Three, or Four D-PHY Data Lanes Per Channel Operating up to 1 Gbps Per Lane
  • Supports 18-bpp and 24-bpp DSI Video Packets with RGB666 and RGB888 Formats
  • Suitable for 60-fps WUXGA 1920 × 1200 Resolution at 18-bpp and 24-bpp Color, and 60-fps 1366 × 768 Resolution at 18-bpp and 24-bpp
  • Output Configurable for Single-Link or Dual-Link LVDS
  • Supports Single-Channel DSI to Dual-Link LVDS Operating Mode
  • LVDS Output-Clock Range of 25 MHz to 154 MHz in Dual-Link or Single-Link Mode
  • LVDS Pixel Clock May be Sourced from Free-Running Continuous D-PHY Clock or External Reference Clock (REFCLK)
  • 1.8 V Main VCC Power Supply
  • Low Power Features Include SHUTDOWN Mode, Reduced LVDS Output Voltage Swing, Common Mode, and MIPI Ultra-Low Power State (ULPS) Support
  • LVDS Channel SWAP, LVDS PIN Order Reverse Feature for Ease of PCB Routing
  • Packaged in 64-pin 10 mm × 10 mm HTQFP (PAP) PowerPAD™ IC Package

The SN65DSI84-Q1 DSI-to-LVDS bridge features a single-channel MIPI D-PHY receiver front-end configuration with four lanes per channel operating at 1 Gbps per lane and a maximum input bandwidth of 4 Gbps. The bridge decodes MIPI® DSI 18-bpp RGB666 and 24-bpp RGB888 packets and converts the formatted video data-stream to an LVDS output operating at pixel clocks operating from 25 MHz to 154 MHz, offering a dual-link LVDS or single-link LVDS with four data lanes per link.

The SN65DSI84-Q1 device is well suited for WUXGA (1920 × 1080) at 60 frames per second (fps) with up to 24 bits-per-pixel (bpp). Partial line buffering is implemented to accommodate the data stream mismatch between the DSI and LVDS interfaces.

The SN65DSI84-Q1 device is implemented in a small outline 10 mm × 10 mm HTQFP package with a
0.5-mm pitch, and operates across a temperature range from –40°C to 105°C.

The SN65DSI84-Q1 DSI-to-LVDS bridge features a single-channel MIPI D-PHY receiver front-end configuration with four lanes per channel operating at 1 Gbps per lane and a maximum input bandwidth of 4 Gbps. The bridge decodes MIPI® DSI 18-bpp RGB666 and 24-bpp RGB888 packets and converts the formatted video data-stream to an LVDS output operating at pixel clocks operating from 25 MHz to 154 MHz, offering a dual-link LVDS or single-link LVDS with four data lanes per link.

The SN65DSI84-Q1 device is well suited for WUXGA (1920 × 1080) at 60 frames per second (fps) with up to 24 bits-per-pixel (bpp). Partial line buffering is implemented to accommodate the data stream mismatch between the DSI and LVDS interfaces.

The SN65DSI84-Q1 device is implemented in a small outline 10 mm × 10 mm HTQFP package with a
0.5-mm pitch, and operates across a temperature range from –40°C to 105°C.

Download

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 2
Type Title Date
* Data sheet SN65DSI84-Q1 Automotive Single-Channel MIPI® DSI to Dual-Link LVDS Bridge datasheet (Rev. A) 12 Jun 2018
Application note Troubleshooting SN65DSI8x - Tips and Tricks 27 Aug 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Package Pins Download
HTQFP (PAP) 64 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos