SLLSEJ4B July   2016  – June 2018 SN65DSI85-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Reset Implementation
      2. 8.3.2 Initialization Setup
      3. 8.3.3 LVDS Output Formats
      4. 8.3.4 DSI Lane Merging
      5. 8.3.5 DSI Pixel Stream Packets
      6. 8.3.6 DSI Video Transmission Specifications
      7. 8.3.7 ULPS
      8. 8.3.8 LVDS Pattern Generation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
    5. 8.5 Programming
      1. 8.5.1 Clock Configurations and Multipliers
    6. 8.6 Register Maps
      1. 8.6.1 Local I2C Interface Overview
        1. 8.6.1.1 Write Procedure
        2. 8.6.1.2 Read Procedure
        3. 8.6.1.3 Setting a Starting Sub-Address Procedure
      2. 8.6.2 Control and Status Registers Overview
      3. 8.6.3 CSR Bit
        1. 8.6.3.1 ID Registers (address = 0x00 to 0x08)
          1. Table 7. ID Register Field Descriptions
        2. 8.6.3.2 Reset and Clock Registers
          1. 8.6.3.2.1 Address 0x09
            1. Table 8. Address 0x09 Definitions
          2. 8.6.3.2.2 Address 0x0A
            1. Table 9. Address 0x0A Field Descriptions
          3. 8.6.3.2.3 Address 0x0B
            1. Table 10. Address 0x0B Field Descriptions
          4. 8.6.3.2.4 Address 0x0D
            1. Table 11. Address 0x0D Field Descriptions
        3. 8.6.3.3 DSI Registers
          1. 8.6.3.3.1 Address 0x10
            1. Table 12. Address 0x10 Field Descriptions
          2. 8.6.3.3.2 Address 0x11
            1. Table 13. Address 0x11 Field Descriptions
          3. 8.6.3.3.3 Address 0x12
            1. Table 14. Address 0x12 Field Descriptions
          4. 8.6.3.3.4 Address 0x13
            1. Table 15. Address 0x13 Field Descriptions
        4. 8.6.3.4 LVDS Registers
          1. 8.6.3.4.1 Address 0x18
            1. Table 16. Address 0x18 Field Descriptions
          2. 8.6.3.4.2 Address 0x19
            1. Table 17. Address 0x19 Field Descriptions
          3. 8.6.3.4.3 Address 0x1A
            1. Table 18. Address 0x1A Field Descriptions
          4. 8.6.3.4.4 Address 0x1B
            1. Table 19. Address 0x1B Field Descriptions
        5. 8.6.3.5 Video Registers
          1. 8.6.3.5.1  Address 0x20
            1. Table 20. Address 0x20 Field Descriptions
          2. 8.6.3.5.2  Address 0x21
            1. Table 21. Address 0x21 Field Descriptions
          3. 8.6.3.5.3  Address 0x22
            1. Table 22. Address 0x22 Field Descriptions
          4. 8.6.3.5.4  Address 0x23
            1. Table 23. Address 0x23 Field Descriptions
          5. 8.6.3.5.5  Address 0x24
            1. Table 24. Address 0x24 Field Descriptions
          6. 8.6.3.5.6  Address 0x25
            1. Table 25. Address 0x25 Field Descriptions
          7. 8.6.3.5.7  Address 0x26
            1. Table 26. Address 0x26 Field Descriptions
          8. 8.6.3.5.8  Address 0x27
            1. Table 27. Address 0x27 Field Descriptions
          9. 8.6.3.5.9  Address 0x28
            1. Table 28. Address 0x28 Field Descriptions
          10. 8.6.3.5.10 Address 0x29
            1. Table 29. Address 0x29 Field Descriptions
          11. 8.6.3.5.11 Address 0x2A
            1. Table 30. Address 0x2A Field Descriptions
          12. 8.6.3.5.12 Address 0x2B
            1. Table 31. Address 0x2B Field Descriptions
          13. 8.6.3.5.13 Address 0x2C
            1. Table 32. Address 0x2C Field Descriptions
          14. 8.6.3.5.14 Address 0x2D
            1. Table 33. Address 0x2D Field Descriptions
          15. 8.6.3.5.15 Address 0x2E
            1. Table 34. Address 0x2E Field Descriptions
          16. 8.6.3.5.16 Address 0x2F
            1. Table 35. Address 0x2F Field Descriptions
          17. 8.6.3.5.17 Address 0x30
            1. Table 36. Address 0x30 Field Descriptions
          18. 8.6.3.5.18 Address 0x31
            1. Table 37. Address 0x31 Field Descriptions
          19. 8.6.3.5.19 Address 0x32
            1. Table 38. Address 0x32 Field Descriptions
          20. 8.6.3.5.20 Address 0x33
            1. Table 39. Address 0x33 Field Descriptions
          21. 8.6.3.5.21 Address 0x34
            1. Table 40. Address 0x34 Field Descriptions
          22. 8.6.3.5.22 Address 0x35
            1. Table 41. Address 0x35 Field Descriptions
          23. 8.6.3.5.23 Address 0x36
            1. Table 42. Address 0x36 Field Descriptions
          24. 8.6.3.5.24 Address 0x37
            1. Table 43. Address 0x37 Field Descriptions
          25. 8.6.3.5.25 Address 0x38
            1. Table 44. Address 0x38 Field Descriptions
          26. 8.6.3.5.26 Address 0x39
            1. Table 45. Address 0x39 Field Descriptions
          27. 8.6.3.5.27 Address 0x3A
            1. Table 46. Address 0x3A Field Descriptions
          28. 8.6.3.5.28 Address 0x3B
            1. Table 47. Address 0x3B Field Descriptions
          29. 8.6.3.5.29 Address 0x3C
            1. Table 48. Address 0x3C Field Descriptions
          30. 8.6.3.5.30 Address 0x3D
            1. Table 49. Address 0x3D Field Descriptions
          31. 8.6.3.5.31 Address 0x3E
            1. Table 50. Address 0x3E Field Descriptions
        6. 8.6.3.6 IRQ Registers
          1. 8.6.3.6.1 Address 0xE0
            1. Table 51. Address 0xE0 Field Descriptions
          2. 8.6.3.6.2 Address 0xE1
            1. Table 52. Address 0xE1 Field Descriptions
          3. 8.6.3.6.3 Address 0xE2
            1. Table 53. Address 0xE2 Field Descriptions
          4. 8.6.3.6.4 Address 0xE5
            1. Table 54. Address 0xE5 Field Descriptions
          5. 8.6.3.6.5 Address 0xE6
            1. Table 55. Address 0xE6 Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Video STOP and Restart Sequence
      2. 9.1.2 Reverse LVDS Pin Order Option
      3. 9.1.3 IRQ Usage
    2. 9.2 Typical Applications
      1. 9.2.1 Typical WUXGA 18-bpp Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Script
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Typical WQXGA 24-bpp Application
        1. 9.2.2.1 Design Requirements
  10. 10Power Supply Recommendations
    1. 10.1 VCC Power Supply
    2. 10.2 VCORE Power Supply
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Package Specific
      2. 11.1.2 Differential pairs
      3. 11.1.3 Ground
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VIL Low-level control signal input voltage 0.3 × VCC V
VIH High-level control signal input voltage 0.7 × VCC V
VOH High-level output voltage IOH = –4 mA 1.25 V
VOL Low-level output voltage IOL = 4 mA 0.4 V
ILKG Input failsafe leakage current VCC = 0; VCC(PIN) = 1.8 V ±30 μA
IIH High level input current Any input terminal ±30 μA
IIL Low level input current Any input terminal ±30 μA
IOZ High-impedance output current CMOS output terminals ±10 μA
IOS Short-circuit output current Any output driving GND short ±50 mA
ICC Device active current See (2) 127 232 mA
IULPS Device standby current All data and clock lanes are in ultra-low power state (ULPS) 7.7 14 mA
IRST Shutdown current EN = 0 0.04 130 µA
REN EN control input resistor 200 kΩ
MIPI DSI INTERFACE
VIH-LP LP receiver input high threshold See Figure 2 880 mV
VIL-LP LP receiver input low threshold See Figure 2 550 mV
|VID| HS differential input voltage 100 270 mV
|VIDT| HS differential input voltage threshold 50 mV
VIL-ULPS LP receiver input low threshold; ultra-low power state (ULPS) 300 mV
VCM-HS HS common mode voltage; steady-state 70 330 mV
ΔVCM-HS HS common mode peak-to-peak variation including symbol delta and interference 100 mV
VIH-HS HS single-ended input high voltage See Figure 2 460 mV
VIL-HS HS single-ended input low voltage See Figure 2 –40 mV
VTERM-EN HS termination enable; single-ended input voltage (both Dp AND Dn apply to enable) Termination is switched simultaneous for Dn and Dp 450 mV
RDIFF-HS HS mode differential input impedance 80 125 Ω
LVDS OUTPUT
|VOD| Steady-state differential output voltage for
A_Yx P/N and B_Yx P/N		 CSR 0x19.3:2=00 and, or CSR 0x19.1:0=00
100 Ω near end termination		 180 245 330 mV
CSR 0x19.3:2=01 and, or CSR 0x19.1:0=01
100 Ω near end termination		 215 293 392
CSR 0x19.3:2=10 and, or CSR 0x19.1:0=10
100 Ω near end termination		 250 341 455
CSR 0x19.3:2=11 and, or CSR 0x19.1:0=11
100 Ω near end termination		 290 389 515
CSR 0x19.3:2=00 and, or CSR 0x19.1:0=00
200 Ω near end termination		 150 204 275
CSR 0x19.3:2=01 and, or CSR 0x19.1:0=01
200 Ω near end termination		 200 271 365
CSR 0x19.3:2=10 and, or CSR 0x19.1:0=10
200 Ω near end termination		 250 337 450
CSR 0x19.3:2=11 and, or CSR 0x19.1:0=11
200 Ω near end termination		 300 402 535
|VOD| Steady-state differential output voltage for
A_CLKP/N and B_CLKP/N		 CSR 0x19.3:2=00 and, or CSR 0x19.1:0=00
100 Ω near end termination		 140 191 262 mV
CSR 0x19.3:2=01 and, or CSR 0x19.1:0=01
100 Ω near end termination		 168 229 315
CSR 0x19.3:2=10 and, or CSR 0x19.1:0=10
100 Ω near end termination		 195 266 365
CSR 0x19.3:2=11 and, or CSR 0x19.1:0=11
100 Ω near end termination		 226 303 415
CSR 0x19.3:2=00 and, or CSR 0x19.1:0=00
200 Ω near end termination		 117 159 220
CSR 0x19.3:2=01 and, or CSR 0x19.1:0=01
200 Ω near end termination		 156 211 295
CSR 0x19.3:2=10 and, or CSR 0x19.1:0=10
200 Ω near end termination		 195 263 362
CSR 0x19.3:2=11 and, or CSR 0x19.1:0=11
200 Ω near end termination		 234 314 435
Δ|VOD| Change in steady-state differential output voltage between opposite binary states RL = 100 Ω 35 mV
VOC(SS) Steady state common-mode output voltage(3) CSR 0x19.6 = 1 and CSR 0x1B.6 = 1; and, or CSR 0x19.4 = 1 and
CSR 0x1B.4 = 1; see Figure 3 		0.75 0.9 1.13 V
CSR 0x19.6 = 0 and, or CSR 0x19.4 = 0; see Figure 3 1 1.25 1.5
VOC(PP) Peak-to-peak common-mode output voltage see Figure 3 35 mV
RLVDS_DIS Pulldown resistance for disabled LVDS outputs 1 kΩ
(1) All typical values are at VCC = 1.8V and TA = 25°C
(2) SN65DSI85-Q1: DUAL Channel DSI to DUAL Channel LVDS, 1920 x 1200
  • number of LVDS lanes = 2 × (3 data lanes + 1 CLK lane)
  • number of DSI lanes = 2 × (4 data lanes + 1 CLK lane
  • LVDS CLK OUT = 81.6 M
  • DSI CLK = 490 M
  • RGB888, LVDS18bpp
Maximum values are at VCC = 1.95 V and TA = 105°C
(3) Tested at VCC = 1.8V , TA = –40°C for MIN, TA = 25°C for TYP, TA = 105°C for MAX.