SLLS926B December   2008  – November 2014 SN65EPT22

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Simplified Schematic
  5. 5Revision History
  6. 6Pin Configuration and Functions
  7. 7Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Power Dissipation Ratings
    4. 7.4 Thermal Information
    5. 7.5 Key Attributes
    6. 7.6 TTL Input DC Characteristics
    7. 7.7 PECL Output DC Characteristics
    8. 7.8 AC Characteristics
    9. 7.9 Typical Characteristics
  8. 8Device and Documentation Support
    1. 8.1 Trademarks
    2. 8.2 Electrostatic Discharge Caution
    3. 8.3 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings(1)

PARAMETER CONDITION MIN MAX UNIT
Absolute supply voltage, VCC 6 V
Absolute input voltage, VI GND = 0 and VI ≤ VCC 0 6 V
Supply voltage LVPEL 3.3 V
Output current Continuous 50 mA
Surge 100
Operating temperature range –40 85 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –4 4 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –2 2
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Power Dissipation Ratings

PACKAGE CIRCUIT BOARD MODEL POWER RATING
TA < 25°C
(mW)		 THERMAL RESISTANCE, JUNCTION TO AMBIENT
NO AIRFLOW		 DERATING FACTOR
TA > 25°C
(mW/°C)		 POWER RATING
TA = 85°C
(mW)
D Low-K 719 139 7 288
High-K 840 119 8 336
DGK Low-K 469 213 5 188
High-K 527 189 5 211

7.4 Thermal Information

THERMAL METRIC(1) D DGK UNIT
8 PINS 8 PINS
RθJB Junction-to-board thermal resistance 79 120 °C/W
RθJC Junction-to-case thermal resistance 98 74
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Key Attributes

CHARACTERISTICS VALUE
Moisture sensitivity level Lead free package
SOIC-8 Level 1
VSSOP-8 Level 3
Flammability rating (Oxygen Index: 28 to 34) UL 94 V-0 at 0.125 in
Meets or exceeds JEDEC Spec EIA/JESD78 latchup test

7.6 TTL Input DC Characteristics(1)

(VCC = 3.3 V, GND = 0, TA = –40°C to 85°C)
CHARACTERISTIC CONDITION MIN TYP MAX UNIT
IIH Input HIGH current VIN = 2.7 V 20 μA
IIHH Input HIGH current max VIN = VCC 100 μA
IIL Input LOW current VIN = 0.5 V –0.6 mA
VIK Input clamp voltage IIN = –18 mA –1 V
VIH Input high voltage 2.0 V
VIL Input low voltage 0.8 V
(1) Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.

7.7 PECL Output DC Characteristics(1)

(VCC = 3.3 V; GND = 0.0V) (2)
CHARACTERISTIC –40°C 25°C 85°C UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
ICC Power supply current 39 45 42 47 45 50 mA
VOH Output HIGH voltage (3) 2155 2224 2405 2155 2224 2405 2155 2224 2405 mV
VOL Output LOW voltage(3) 1355 1441 1605 1355 1438 1605 1355 1435 1605 mV
(1) Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
(2) Output parameters vary 1:1 with VCC
(3) All loading with 50Ω to VCC –2.0V

7.8 AC Characteristics (1)

(VCC = 3.0 V to 3.6 V; GND = 0 V)(2)
CHARACTERISTIC –40°C 25°C 85°C UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
fMAX Max switching frequency(5), see Figure 5 2.1 2.0 2.0 GHz
tPLH / tPHL Propagation delay to differential output 230 550 230 550 230 550 ps
tSKEW Within device skew(3) 25 50 25 50 25 50 ps
Device to device skew(4) 100 200 100 200 100 200 ps
tJITTER Random clock jitter (RMS) 0.2 0.8 0.2 0.8 0.2 0.8 ps
tr / tf Output rise/fall times (20%–80%) 150 300 150 300 150 300 ps
(1) Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
(2) Measured using a 2.4 V source, 50% duty cycle clock source. All loading with 50 Ω to VCC – 2.0 V.
(3) Skew is measured between outputs under identical transitions and conditions on any one device.
(4) Device−to−Device Skew for identical transitions at identical VCC levels.
(5) Maximum switching frequency measured at output amplitude of 300 mVpp.
op_driver_lls926.gifFigure 1. Termination for Output Driver
op_dly_lls926.gifFigure 2. Output Propagation Delay
rise_fall_t_lls926.gifFigure 3. Output Rise and Fall Times
skew_lls926.gifFigure 4. Device Skew

7.9 Typical Characteristics

amp_f_lls926.gifFigure 5. Output Amplitude versus Frequency