SLLS771F November   2006  – March 2023 SN65HVD3080E , SN65HVD3083E , SN65HVD3086E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Power Dissipation Ratings
    3. 5.3  Electrostatic Discharge Protection
    4. 5.4  Supply Current
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Driver Electrical Characteristics
    8. 5.8  Driver Switching Characteristics
    9. 5.9  Receiver Electrical Characteristics
    10. 5.10 Receiver Switching Characteristics
    11. 5.11 Typical Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Device Information
    1. 7.1 Function Tables
    2. 7.2 Equivalent Input and Output Schematic Diagrams
  8. 8 Application Information
    1. 8.1 Hot-Plugging
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Thermal Information

THERMAL METRIC(1)D (SOIC)DGS (VSSOP)UNIT
14 PINS10 PINS
RθJAJunction-to-ambient thermal resistance93.275.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance47.522.0°C/W
RθJBJunction-to-board thermal resistance49.444.9°C/W
ψJTJunction-to-top characterization parameter11.21.0°C/W
ψJBJunction-to-board characterization parameter48.944.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.