SCAS956D May   2023  – March 2024 SN74AC244-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics 1.5-V VCC
    7. 5.7  Switching Characteristics 1.8-V VCC
    8. 5.8  Switching Characteristics 2.5-V VCC
    9. 5.9  Switching Characteristics 3.3-V VCC
    10. 5.10 Switching Characteristics 5-V VCC
    11. 5.11 Noise Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
      4. 7.3.4 Wettable Flanks
    4. 7.4 Device Functional Modes
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKS|20
  • DGS|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20210730-SS0I-6FGJ-V3VL-1HLPZRRWNCKT-low.gifFigure 4-1 RKS Package, 20-Pin VQFN (Top View)
GUID-20231019-SS0I-SZKB-HZND-JDLR2HFPQDZQ-low.svgFigure 4-2 DGS or PW Package, 20-Pin VSSOP or TSSOP (Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
1OE 1 I Bank 1, output enable, active low
1A1 2 I Bank 1, channel 1 input
2Y4 3 O Bank 2, channel 4 output
1A2 4 I Bank 1, channel 2 input
2Y3 5 O Bank 2, channel 3 output
1A3 6 I Bank 1, channel 3 input
2Y2 7 O Bank 2, channel 2 output
1A4 8 I Bank 1, channel 4 input
2Y1 9 O Bank 2, channel 1 output
GND 10

G

 Ground
2A1 11 I Bank 2, channel 1 input
1Y4 12 O Bank 1, channel 4 output
2A2 13 I Bank 2, channel 2 input
1Y3 14 O Bank 1, channel 3 output
2A3 15 I Bank 2, channel 3 input
1Y2 16 O Bank 1, channel 2 output
2A4 17 I Bank 2, channel 4 input
1Y1 18 O Bank 1, channel 1 output
2OE 19 I Bank 2, output enable, active low
VCC 20

P

 Positive supply
Thermal pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = input, O = output, I/O = input or output, G = ground, P = power.
(2) RKS package only.