SLVSJ68 June   2025 SN74ACT157-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Wettable Flanks
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74ACT157-Q1 PW Package, 16-Pin TSSOP (Top View) Figure 4-1 PW Package, 16-Pin TSSOP (Top View)
SN74ACT157-Q1 BQB Package, 16-Pin WQFN (Top View) Figure 4-2 BQB Package, 16-Pin WQFN (Top View)
Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 A/B I Address select
2 1A I Channel 1, data input A
3 1B I Channel 1, data input B
4 1Y O Channel 1, data output
5 2A I Channel 2, data input A
6 2B I Channel 2, data input B
7 2Y O Channel 2, data output
8 GND G Ground
9 3Y O Channel 3, data output
10 3B I Channel 3, data input B
11 3A I Channel 3, data input A
12 4Y O Channel 4, data output
13 4B I Channel 4, data input B
14 4A I Channel 4, data input A
15 G I Output strobe, active low
16 VCC P Positive supply
Thermal pad(2) — The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(2) BQB package only.