9 Revision History
Changes from Revision M (June 2023) to Revision N (February 2024)
- Added package size to Device Information
tableGo
- Updated RθJA value: D = 124.5 to 124.6, all values in °C/W Go
- Added Application and Implementation section.Go
Changes from Revision L (May 2013) to Revision M (June 2023)
- Added Package Information table, Pin Functions table,
ESD Ratings table, Thermal
Information table, Device Functional
Modes,
Device and Documentation Support
section, and Mechanical, Packaging, and
Orderable Information section Go
- Added BQA package to Package Information
tableGo
- Updated thermal values for RθJA: D = 86 to 124.5, PW = 113 to 147.7,
all values in °C/WGo
- Added thermal value for RθJA: BQA = 88.3, all values in
°C/WGo
- Added Power Supply Recommendations and Layout sections.Go