SCLS256O December   1995  – February 2024 SN54AHC125 , SN74AHC125

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7  Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8  Noise Characteristics
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
      2. 9.1.2 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • BQA|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SNx4AHC125 UNIT
D (SOIC) DB (SSOP) NS (SO) DGV (TVSOP) PW (TSSOP) N (PDIP) RGY (VQFN) BQA (WQFN)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 124.5 107.3 89.9 134.6 147.7 56.3 87.1 88.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 78.8 59.3 47.7 53.9 77.4 43.9 92.6

90.9

 °C/W
RθJB Junction-to-board thermal resistance 81 54.7 48.6 63.8 90.9 36.1 62.5

56.8

 °C/W
ψJT Junction-to-top characterization parameter 37 24 17.5 6.3 27.2 29.2 22.8

9.9

 °C/W
ψJB Junction-to-board characterization parameter 80.6 54.1 48.3 63.2 90.2 36 61.7

56.7

 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A 45.1

33.4

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.