SN74AHC125

ACTIVE

Quadruple Bus Buffer Gates With 3-State Outputs

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Product details

Parameters

Technology Family AHC VCC (Min) (V) 2 VCC (Max) (V) 5.5 Channels (#) 4 IOL (Max) (mA) 8 ICC (Max) (uA) 40 IOH (Max) (mA) -8 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs Data rate (Mbps) 220 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

PDIP (N) 14 181 mm² 19.3 x 9.4 SOIC (D) 14 52 mm² 8.65 x 6 SOP (NS) 14 80 mm² 10.2 x 7.8 SSOP (DB) 14 48 mm² 6.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4 TVSOP (DGV) 14 23 mm² 3.6 x 6.4 VQFN (RGY) 14 12 mm² 3.5 x 3.5 open-in-new Find other Non-Inverting buffer/driver

Features

  • Operating Range: 2 V to 5.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Four Individual Output Enable Pins
  • All Inputs Have Schmitt-Trigger Action
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Description

The SNx4AHC125 devices are quadruple bus buffer gates featuring independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high. When OE is low, the respective gate passes the data from the A input to its Y output.

To ensure the high-impedance state during power up or power down, OE must be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SNx4AHC125 Quadruple Bus Buffer Gates With 3-State Outputs datasheet (Rev. L) Nov. 29, 2016
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) Dec. 02, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
User guide AHC/AHCT Designer's Guide February 2000 (Rev. D) Feb. 24, 2000
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) Sep. 08, 1999
More literature Military Advanced High-Speed CMOS Logic (AHC/AHCT) Apr. 01, 1998
More literature Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) Apr. 01, 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Live Insertion Oct. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARD Download
20
Description
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic and translation devices with included dual supply support
  • Board has 9 sections that can be broken apart for a smaller form factor

Design tools & simulation

SIMULATION MODEL Download
SCLM079.ZIP (47 KB) - IBIS Model
SIMULATION MODEL Download
SCLM282.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
PDIP (N) 14 View options
SO (NS) 14 View options
SOIC (D) 14 View options
SSOP (DB) 14 View options
TSSOP (PW) 14 View options
TVSOP (DGV) 14 View options
VQFN (RGY) 14 View options

Ordering & quality

Information included:
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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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