SCLS238P October   1995  – February 2024 SN54AHC14 , SN74AHC14

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • BQA|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74AHC14 UNIT
D (SOIC) DB (SSOP) DGV (TVSOP) N (PDIP) NS (SO) PW (TSSOP) RGY (VQFN) BQA (WQFN)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient
thermal resistance		 124.5 137.8 141.9 61.9 94.7 147.7 87.1

88.3

 °C/W
RθJC(top) Junction-to-case (top)
thermal resistance		 78.8 90 61.1 49.5 52.5 77.4 92.6

90.9

 °C/W
RθJB Junction-to-board
thermal resistance		 81 98.3 71.3 41.7 53.4 90.9 62.5

56.8

 °C/W
ψJT Junction-to-top
characterization parameter		 37 42.7 9.7 34.7 21.3 27.2 22.8

9.9

 °C/W
ψJB Junction-to-board
characterization parameter		 80.6 97 70.6 41.7 53.1 90.2 61.7

56.7

 °C/W
RθJC(bot) Junction-to-case (bottom) thermal
resistance		 N/A N/A N/A N/A N/A N/A 45.1

33.4

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.