10 Revision History
Changes from Revision A (October 2023) to Revision B (January 2024)
- Added DBV package to Package Information table; added ESD
classification to Features sectionGo
- Added DBV package to Pin Configuration and Functions
sectionGo
- Added thermal values for DBV package: RθJA = 278.0, all values in
°C/WGo
- Updated Layout Example; removed Typical Application
sectionGo
Changes from Revision * (December 2010) to Revision A (October 2023)
- Added Applications section, Package Information table,
Pin Functions table, Thermal Information table, Device
Functional Modes,
Application and Implementation section,
Device and Documentation Support section, and Mechanical, Packaging,
and Orderable Information section Go
- Updated RθJA values: DCK = 252 to 289.2, all values in °C/W Go