SCES579J JUNE 2004 – September 2017 SN74AUP1G17
The AUP family of devices is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity).
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
|PART NUMBER||PACKAGE||BODY SIZE (NOM)|
|SN74AUP1G17DBV||SOT-23 (5)||1.60 mm × 2.90 mm|
|SN74AUP1G17DCK||SC70 (5)||1.25 mm × 2.00 mm|
|SN74AUP1G17DRL||SOT-5X3 (5)||1.60 mm × 1.20 mm|
|SN74AUP1G17DRY||SON (6)||1.00 mm × 1.45 mm|
|SN74AUP1G17DSF||SON (6)||1.00 mm × 1.00 mm|
|SN74AUP1G17YFP||DSBGA (4)||0.76 mm × 0.76 mm|
|SN74AUP1G17YZP||DSBGA (5)||0.89 mm × 1.39 mm|
|SN74AUP1G17DPW||X2SON (5)||0.80 mm × 0.80 mm|