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Product details

Parameters

Technology Family AUP VCC (Min) (V) 0.8 VCC (Max) (V) 3.6 Channels (#) 1 IOL (Max) (mA) 4 ICC (Max) (uA) 0.9 IOH (Max) (mA) -4 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Data rate (Mbps) 200 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

DSBGA (YFP) 4 0 mm² .8 x .8 DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 5 3 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DPW) 5 1 mm² .8 x .8 X2SON (DSF) 6 1 mm² 1 x 1 open-in-new Find other Non-Inverting buffer/driver

Features

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5.1 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

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Description

The AUP family of devices is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity).

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 8
Type Title Date
* Datasheet SN74AUP1G17 Low-Power Single Schmitt-Trigger Buffer datasheet (Rev. J) Sep. 29, 2017
Application note Debounce a Switch Oct. 08, 2020
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Application note Designing and Manufacturing with TI's X2SON Packages Aug. 23, 2017
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Understanding Schmitt Triggers Sep. 21, 2011
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODEL Download
SCEM425B.ZIP (64 KB) - IBIS Model
SIMULATION MODEL Download
SCEM686.ZIP (7 KB) - PSpice Model

Reference designs

REFERENCE DESIGNS Download
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TIDA-00377 — The self-powered AC solid state relay with MOSFETs reference design is a single relay replacement that enables efficient power management for a low-power alternative to standard electromechanical relays in thermostat applications. This SSR reference design is self-powered through the 24V AC power (...)
document-generic Schematic
REFERENCE DESIGNS Download
Thunderbolt™ Single Port Peripheral Reference Design
TIDA-00268 The TI Thunderbolt™ Single Port Peripheral reference design is optimized for Thunderbolt 2 systems which have a bandwidth of 20Gbps. The design utilizes the TPS65980 power management unit to reduce the BOM cost up to 50% and reduce the area about 40% over a discrete implementation. This design (...)
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CAD/CAE symbols

Package Pins Download
DSBGA (YFP) 4 View options
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 5 View options
SOT-5X3 (DRL) 5 View options
X2SON (DPW) 5 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

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